Advance Program - Prototype Today

Advance Program - Prototype Today

32nd Hyatt Regency® Miami | Miami, FL, USA October 6 –10, 2013 Advance Program Congress General Chair: Stefan Kaierle, L aser Zentrum Hannover e.V...

4MB Sizes 1 Downloads 20 Views

Recommend Documents

Advance Program
Jul 26, 2005 - Carl K. Chang, Iowa State Univ., USA. Dick B. Simmons, Texas A & M. Univ., USA. T. H. Tse, The Univ. of H

advance program -
Sep 2, 2017 - s B ridge. FACILITIES. David L. Lawrence Convention Center. PPG Paints Arena. Heinz Field. PNC Park. DOWNT

ADVANCE Institutional Transformation Program History
University of Alabama, Birmingham (AL). University of Texas, El Paso (TX). Kansas State University (KS). Utah State Univ

advance program - ACSM Annual Meeting
Apr 19, 2017 - Applications of 'Exercise is Medicine®'. Friday, June 2, 3:15-5:15 p.m.. Chair: Steven K. Malin. Kim Huf

Advance Auto Parts Program - ASA National
Advance Professional is proud to be a preferred supplier of ASA. Combined ... CARQUEST Auto Parts are eligible for natio

Advance Program - Siggraph 2015 - ACM Siggraph
Aug 10, 2011 - Entertainment's Overwatch. 3:45-5:35 pm ..... INVITED. USA. League of Legends Music: Curse of ... JAPAN.

UIM P750 THUNDERCAT. 2015 WORLD CHAMPIONSHIPS. MELLIEHA BAY, MALTA. 10th – 17th October 2015. Classes: Stock, Pro-Stoc

2017 advance program - Controversies, Problems & Techniques in
contemporary 55-story tower, the hotel provides a stunning venue for business and social ... Each of Lotte New York Pala

prototype 9
JARNDYCE v JARNDYCE. VCC ARBITRATION NOS: 15362/4FM and 15365/4FM. 29th August 2012. PAGE 1. 01. 02. 03. 04. 05. 06. 07.

BKCommencement Program '04-body - CSI Today
Jun 2, 2011 - Joanne Brennan. CSI Auxiliary Services Corporation Award ..... Philip Brennan. Brian Shane Brice * ......


Hyatt Regency® Miami | Miami, FL, USA

October 6 –10, 2013

Advance Program Congress General Chair: Stefan Kaierle, L aser Zentrum Hannover e.V., Hannover, Germany Laser Materials Processing Conference Chair: Silke Pflueger, DirectPhotonics, Los Gatos, CA, USA Laser Microprocessing Conference Chair: Henrikki Pantsar, C  encorp Oyj, Salo, Finland Nanomanufacturing Conference Co-Chairs: Yongfeng Lu, Univ. of Nebraska-Lincoln, Lincoln, NE, USA Xianfan Xu, Purdue Univ., West Lafayette, IN, USA Laser Solutions Short Courses Chair: Kerstin Kowalick, Ruhr Univ. Bochum, Bochum, Germany Business Forum & Panel Discussion Chair: Klaus Loeffler, TRUMPF Laser and Systems GmbH, Ditzingen, Germany

Presented by:

Plenary Sessions & Receptions

TRUMPF TruMicro Lasers Versatility Meets Quality and Speed TRUMPF’s TruMicro lasers feature lightning fast production speeds in laser micro-processing with unmatched low operation costs and high duty cycles resulting in the lowest cost per part. The TruMicro Series 5000 and 7000 offer the highest speed and highest quality in cutting, drilling and ablating in metals, semiconductors, dielectrics, polymers and composites.



For more information scan the QR code with your smartphone.

[email protected]

Miami, FL, USA

ICALEO Advance Program

October 6–10, 2013 Hyatt Regency® Miami

Table of Contents: Plenary Sessions & Receptions. . . . . . . . . . . . . Page 05 LIA Annual Meeting & Awards Luncheon . . . . Page 07 Laser Materials Processing Conference . . . . . . Page 08 Laser Microprocessing Conference . . . . . . . . . Page14 Student Paper Award Contest. . . . . . . . . . . . . Page 16

�elcome… to Miami! The 32nd International Congress on Applications of Lasers & Electro-Optics (ICALEO®) finally returns to the “Magic City,” Stefan Kaierle continuing its over 30 year history of being the Laser Zentrum Hannover e.V., most important conference worldwide in the Hannover, Germany field of laser materials processing.

Nanomanufacturing Conference. . . . . . . . . . . Page17 Poster Presentation Gallery. . . . . . . . . . . . . . . Page 18 Business Forum & Panel Discussion. . . . . . . . . Page 19 Laser Solutions Short Courses. . . . . . . . . . . . . Page 21 About LIA. . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 23 General Information. . . . . . . . . . . . . . . . . . . . Page 25 Conference Agenda. . . . . . . . . . . . . . . . . . . . Page 26

Congress General Chair: Stefan Kaierle LIA President: Klaus Loeffler LIA Executive Director: Peter Baker LIA Director of Conferences: Gail Loiacono

ICALEO 2013 will feature the three conferences on Laser Materials Processing (LMP, organized by Silke Pflueger), Laser Microprocessing (LMF, organized by Henrikki Pantsar), and Nanomanufacturing (co-organized by Yongfeng Lu and Xianfan Xu). The Laser Materials Processing Conference traditionally covers a wide range of topics on laser macro processing addressing various applications, related laser equipment, and systems. The Laser Microprocessing Conference addresses processes and systems for microscopic applications while the Nanomanufacturing Conference provides recent findings on the nano-scale. The ICALEO program committee has put together yet another highly interesting program with outstanding contributions from research and engineering covering all parts of emerging laser applications. The plenary session will provide superb and groundbreaking presentations of internationally recognized experts about Photonic applications in all dimensions, followed by the sub-plenary sessions of LMP and the joint LMF/Nano. Special features of this year’s ICALEO are also the laser business session, organized by Klaus Loeffler, and the vendor reception, both addressing the latest industrial developments in the field. Special attention is given again to the Laser Solutions Short Courses, organized by Kerstin Kowalick, jointly conducted on the day before the main conference providing a comprehensive overview on selected topics. Tying with a young tradition ICALEO will be concluded with the closing plenary session addressing the leading-edge developments in digital photonic production with lasers. Besides being a strong information pool for the latest results in research and development ICALEO also has become a major meeting point for the whole laser community where young professionals can easily get in touch with the senior experts! Plenty of networking opportunities perfect the yield of the event. Be part of it and discuss the applications and trends of tomorrow. You are warmly welcomed to share this unique experience together with all conference attendees in beautiful Miami! See you there!


[email protected]


FINDING ONE-STOP SOLUTIONS in  High speed and remote laser cutting  Laser welding and special joining technologies  Laser hardening and thermal treatment  Laser cladding  PVD and CVD technologies  Process components and complete systems


Fraunhofer IWS Dresden

Winterbergstraße 28

01277 Dresden, Germany

Email: [email protected]

phone: +49 351 833 910


[email protected]

Plenary Sessions & Receptions

Plenary Session: Photonic Applications in All Dimensions Session Chair: Stefan Kaierle, Laser Zentrum Hannover e.V., Hannover, Germany Monday, October 7th • 9:00am It is tradition to present extraordinary topics in the field of lasers and photonics during the ICALEO® plenary session. The program committee has managed to acquire three outstanding speakers of very complementary fields, covering photonic applications in all dimension: Ramesh Raskar from the Massachusetts Institute of Technology will open the conference with his keynote speech on femto-photography, explaining how cameras can "look around corners“ or can see into the human body without X-rays. Boris Chichkov from the Laser Zentrum Hannover will present his latest findings in laser based nano-technology, especially in 3D tissue engineering and cell printing. Yet another hot topic of today is the laser additive manufacturing of large and complex parts in series production. Huaming Wang from the Beijing University of Aeronautics & Astronautics will present the challenges and latest progress in this field with special attention to aerospace applications.

Invited Plenary Speakers:

Welcome Celebration

Femto-Photography: Trillion Frames per Second Imaging to See Around Corners (OP1) Ramesh Raskar, MIT Media Lab, Cambridge, MA, USA

Sunday, October 6th • 4:00pm Sponsored by:

Laser-Based Nanotechnologies for Photonics and Biomedicine (OP2) Boris Chichkov, Laser Zentrum Hannover e.V., Hannover, Germany Laser Additive Manufacturing for High Performance Large and Complex Metallic Structural Components: Challenges and Progresses (OP3) Huaming Wang, Beijing Univ. of Aeronautics & Astronautics (BUAA), Beijing, People's Republic of China

Plan to arrive early and enjoy live entertainment provided by Beer's Law. In addition, free door prizes will be raffled! This event is a great opportunity for new attendees to meet 'old timers' and for everyone to socialize and interact.

Session Chair Appreciation Breakfast Monday, October 7th • 7:30am Session Chairs are invited to the Session Chair Appreciation Breakfast on Monday, October 7, at 7:30am. Audio-Visual tips will be provided along with any last minute updates and an overview of the week. Please plan to arrive in time to attend this important breakfast.

ICALEO President’s Reception Monday, October 7th • 5:30pm The opening day of ICALEO® features an evening reception hosted by LIA President Klaus Loeffler. Meet the LIA Executive Committee, Board of Directors, ICALEO® General Chair Stefan Kaierle and Conference Chairs Silke Pflueger, Henrikki Pantsar, Yongfeng Lu and Xianfan Xu. Join the LIA staff and mingle with old friends at this exciting event. This will be an unforgettable evening!


[email protected]


Plenary Sessions & Receptions

LIA Annual Meeting & Awards Luncheon featuring the Arthur L. Schawlow Award Presentation

Luncheon Sponsored by:

Wednesday, October 9th

The 2013 Arthur L. Schawlow Award is presented to: Ursula Keller Ursula Keller, a professor of physics at ETH since 1993, leads the Ultrafast Laser Physics group, and currently also serves as a director of the Swiss multi-institute NCCR MUST program in ultrafast science since 2010. Born 1959 in Zug, Switzerland, she received the Physics "Diplom" from ETH Zurich in 1984 and the Ph.D. in Applied Physics from Stanford University, USA in 1989. She was a Member of Technical Staff (MTS) at AT&T Bell Laboratories in New Jersey from 1989 to 1993. She was a “Visiting Miller Professor” at UC Berkeley in 2006 and a visiting professor at the Lund Institute of Technologies in 2001. She has been a co-founder and board member for Time-Bandwidth Products since 1995 and for GigaTera from 2000 to 2003, a venture capital funded telecom company during the “bubble phase” which was acquired by Time-Bandwidth in 2003. Her research interests are exploring and pushing the frontiers in ultrafast science and technology: ultrafast solid-state and semiconductor lasers, ultrashort pulse generation in the one to two optical cycle regime, frequency comb generation and stabilization, reliable and functional instrumentation for extreme ultraviolet to X-ray generation, attosecond experiments using high harmonic generation and attosecond science. Awards include the ERC advanced grant in 2012, EPS Senior Prize in 2011 “for seminal contribu­tions to ultrafast solid-state lasers, telecom, metrology, and attosecond science”, the OSA Fraunhofer/Burley Prize 2008, the Leibinger Innovation Prize 2004, and the Zeiss Research Award 1998. The Thomson Citation Index ranked her as the third-place top-cited researcher during the decade 1991-99 in optoelectronics. OSA Fellow, EPS Fellow, member of the Royal Swedish Academy of Sciences and the Academy Leopoldina, more than 340 peer-reviewed journal publications with >13,000 citations and an h-index of 61 (Web of Science Citation Report, June 2013).

About Arthur L. Schawlow Professor Schawlow received a Nobel Prize for Physics in 1981 for “his contribution to the development of laser spectroscopy.” He co-authored, along with Professor Charles H. Townes, the book Microwave Spectroscopy, and the first paper describing optical masers. For this latter work, the pair were awarded the Stuart Ballantine Medal by the Franklin Institute (1962) and the Thomas Young Medal and Prize by the Physical Society and Institute of Physics (1963). Professor Schawlow was also awarded the Morris N. Liebmann Memorial Prize by the Institute of Electrical and Electronic Engineers (1964). As the first honoree of this award in 1982, it is fitting that LIA’s highest achievement award is given in Professor Schawlow’s name.

Closing Plenary Session: Digital Photonic Production Across All Scales Session Chair: Stefan Kaierle, Laser Zentrum Hannover e.V., Hannover, Germany Thursday, October 10th • 1:30pm The generation of complex parts with almost any kind of shape is a major accomplishment of photon based technologies. The freedom to build up parts in a way which would not be possible with any other manufacturing technology has already issued the paradigm of a new technological revolution. Honoring this important and emerging production technology is the aim of this year’s ICALEO® closing plenary session. The processes and procedures behind that fascinating technology, including challenges and recent progress, are presented in talks covering the whole range of scales from nano (2 photon polymerization) via micro to macro, hence covering the different generative processes like laser metal deposition and selective laser melting with their latest results. Digital Photonic Production - A New Industrial Revolution? (C101) Christian Hinke, Fraunhofer ILT, Germany Laser Nano Component Build-up (C102) Hung-Bo Sun, Jilin Univ., People's Republic of China Additive Manufacturing in Micro Scale (C103) Christian Noelke, Laser Zentrum Hannover e.V., Germany Laser Additive Manufacture and Aerospace Industry (C104) Milan Brandt, RMIT Univ., Australia Recent Progress in Additive Manufacturing and Repair Using the LENS Laser Metal Deposition Process (C105) Richard Grylls, O  ptomec, USA Additive Manufacturing Achieves Acceptance as a Viable Manufacturing Process for a Variety of Applications (C106) Tim Morris, EOS of North America, USA


[email protected]


Laser Materials Processing Conference Conference Chair: Silke Pflueger, DirectPhotonics, Los Gatos, CA, USA ICALEO® continues to be the most comprehensive and important event for laser material processing, and is an important forum for new ideas, collaboration and education. Thanks to a steady stream of improved and more affordable laser sources, laser applications continue expanding their role across many different manufacturing industries. While many of the processes have roots almost as old as the laser itself, they are continuously improved and research remains a critical component in expanding the role of lasers. The LMP conference consists of presentations and posters from 23 countries on four continents. The work presented covers the gamut of macro laser applications, from new exciting new work in traditional applications such as cutting and welding, all the way to the new hot topic of 3D printing, represented at LMP by over 20 papers on the topic of laser assisted manufacturing. The conference offers something for everybody, from researcher to laser engineer: Numerical simulation and modeling of processes that enable a better understanding of the underlying physical effects all the way to industrial systems introducing novel applications into manufacturing lines. Major progress in understanding, controlling and applying the welding process is going to be the topic of this year’s LMP sub-plenary. Further topics being addressed are plastic welding and CFRP processing, drilling, material and beam characterization, and new beam sources for different applications.

LMP Session 2: New Laser Sources

LMP Session 1: A  New Look at Welding Monday, October 7 • 1:30pm th

Session Chair: Silke Pflueger, DirectPhotonics, Los Gatos, CA, USA Advanced Welding Techniques with Optimized Accessories for High Brightness 1µm Lasers (101) Andrey Andreev, Marco Holzer, Volker Rominger, Thomas Harrer, TRUMPF Laser- Und Systemtechnik GmbH; David Havrilla, TRUMPF, Inc. Comparison of High-Speed Imaging of the Capillary in Welding Experiments of Ice with High-Speed Videos Obtained by X-Ray Technique and Observations of the Melt Surface in Welding of Steel, Aluminum and Copper (102) Peter Berger, Meiko Boley, Andreas Heider, Rudolf Weber, Thomas Graf, IFSW, Univ. of Stuttgart Inline Coherent Imaging of High Power Laser Processing: Development, Diagnosis and Control (103) Paul Webster, Cole Van Vlack, Laser Depth Dynamics; Christopher Galbraith, Alison Kinross, Logan Wright, Queens Univ.; Meiko Boley, Rudolf Weber, Thomas Graf, IFSW, Univ. of Stuttgart Vertical-Down Hybrid Welding in Ship Building – The Next Innovation Step (104) Simon Olschok, Uwe Reisgen, RWTH Aachen Univ., ISF

Special Thanks to the ICALEO International Advisory Board: David Belforte, Industrial Laser Solutions, Sturbridge, MA, USA Eckhard Beyer, Fraunhofer IWS, Dresden, Germany Jan Dubowski, Universite de Sherbrooke, Sherbrooke, QC, Canada Thomas Fehn, JENOPTIK Laser GmbH, Jena, Germany Thomas Graf, Institut fuer Strahlwerkzeuge, Stuttgart, Germany Bo Gu, Bos Photonics, North Andover, MA, USA Paul Hilton, TWI Ltd., Great Abington, Cambridge, Great Britain Tony Hoult, IPG Photonics Corporation, Santa Clara, CA, USA Dietmar Kracht, Laser Zentrum Hannover e.V., Hannover, Germany Xinbing Liu, Panasonic Boston Laboratory, Newton, MA, USA Yongfeng Lu, Univ. of Nebraska – Lincoln, Lincoln, NE, USA Jyoti Mazumder, CLAIM, The Univ. of Michigan, Ann Arbor, MI, USA Andreas Osterdorf, Ruhr-Univ. Bochum, Bochum, Germany Rajesh Patel, N  ewport Corporation, Santa Clara, CA, USA Koji Sugioka, RIKEN, Saitama, Japan Kunihiko Washio, Paradigm Laser Research Ltd, Tokyo, Japan Rongshi Xiao, Beijing Univ. of Technology, Beijing, People’s Republic of China Minlin Zhong, Tsingshua Univ., Beijing, People’s Republic of China



Monday, October 7th • 3:20 PM

Session Chair: Oliver Suttmann, Laser Zentrum Hannover e.V., Hannover, Germany Cutting of Stainless Steel, Low Carbon Steel and Aluminum with Ultra-High Brightness 2 kW Direct Diode Laser (201) Narasimhan Sreenivassan, Michael Deutsch, James Burgess, Bien Chann, Chris Haskell, Jay Liebowitz, Parviz Tayebati, Teradiode Inc. Understanding Laser Materials Processing with a New Fiber Laser Wavelength (202) Tony Hoult, IPG Photonics Silicon Valley Technology Center Lasers with Line Focus Geometries As Universal Tool for a Wide Range of Surface Processing Applications (204) Jens Meinschien, Lutz Aschke, Mikhail Ivanenko, Limo Lissotschenko Mikrooptik GmbH

LMP Session 3: LAM in Biomedical Monday, October 7th • 3:20 PM

Session Chair: Yingchun Guan, Singapore Institute of Manufacturing Technology, Singapore, Republic of Singapore Marine Resources and Sub-Products Valorization for Medical Applications by Laser Assisted Techniques (301) Mohamed Boutinguiza, Rafael Comesaña, Jesus Del Val, Felipe AriasGonzález, Joaquin Penide, Felix Quintero, Antonio Riveiro, Fernando Lusquiños, Univ. of de Vigo Progress in 3D: Future of de Vigo Medical Implants (302) Christian Noelke, Laser Zentrum Hannover e.V. Combinatorial Laser-Assisted Development of Novel Ti-Ta Alloys for Biomedical Applications (303) Amelia Almeida, Carole Loable, Martim Teixeira, Rui Vilar, Instituto Superior Tecnico, Universidade Tecnica De Lisboa and Icems - Instituto De Ciencia E Engenharia De Materiais E Superficies Bioactive Glass-Ceramic Coatings on Al203-ZrO2 Composite Substrates by Laser Cladding for Orthopaedic Applications (304) Jorge Luis Arias, M. Angeles Montealegre, Aimen- Technology Centre; Francesco Baino, Chiara Vitale-Brovarone, Politecnico Di Torino; Martyn Marshall, Glass Technology Services Ltd.; Joaquim Minguella, Fundacióncim C/ Llorens I Artigas

[email protected]

Laser Materials Processing Conference LMP Session 4: Modeling and Simulation

LMP Session 6: Plastic Welding

Tuesday, October 8th • 8:30 AM

Tuesday, October 8th • 8:30 AM

Session Chair: Remy Fabbro, PIMM Laboratory CNRS Paris, Paris, France

Session Chair: Klaus Kleine, Coherent, Santa Clara, CA, USA

Numerical Simulation of Electromagnetic Melt Control Systems in High Power Laser Beam Welding (401) Marcel Bachmann, Vjaceslav Avilov, Andrey Gumenyuk, Michael Rethmeier, Bam Federal Institute for Materials Research and Testing Thermohydraulic Modeling of Pulsed Laser Welding (402) Vincent Bruyere, Charline Touvrey, CEA Numerical Analysis and Experimental Study on Centerline Hot Crack Prevention in Laser Beam Welding of Aluminum Alloys (403) Peter Stritt, Rudolf Weber, Thomas Graf, IFSW, Univ. of Stuttgart Numerical Simulation of a Combined Welding-Brazing Process Application to an Aluminum-Titanium Heterogeneous Assembly (404) Morgan Dal, Pimm, Umr 8006 CNRS - Arts et Métiers ParisTech A Complete Modeling of Heat and Fluid Flow During Keyhole Laser Welding Using a New Approach to Treat Laser Reflections (405) Muriel Carin, Mickael Courtois, Philippe Le Masson, Limatb - Ea 4250; Sadok Gaied, Arcelormittal Simulation of Process Dynamics in Laser Beam Brazing (406) Michael Dobler, Karl-Heinz Leitz, Michael Schmidt, Institute of Photonic Technologies and Erlangen Graduate School in Advanced Optical Technologies (SAOT), Univ. of Erlangen-Nuremberg; Andreas Otto, Institute for Production Engineering and Laser Technology, Vienna Univ. of Technology A Numerical Model Based Reliability Estimation of the Selective Laser Melting Process (407) Sankhya Mohanty, Ismet Baran, Jesper Hattel, Technical Univ. of Denmark 2D Modeling of Surface Tension Effect During Laser Metal Cutting (408) El-Hachemi Amara, Karim Kheloufi, Toufik Tamsaout, Centre for Development of Advanced Technologies Numerical Analysis of the Influence of Beam Characteristics onto the Process Dynamics During Laser Cutting (409) Stefanie Kohl, Michael Schmidt, Institute of Photonic Technologies, Univ. of Erlangen-Nuremberg

Laser Joining of Endless Long Fiber Reinforced Thermoplastics with Aluminum (601) Jean Pierre Bergmann, Benedikt Ruhdorfer, Martin Stambke, Ilmenau Univ. of Technology Laser-Based Joining of Three-Dimensional Thermoplastic Parts and Thermoplastic Aluminium Hybrids (602) Martin Devrient, Philipp Amend, Bayerisches Laserzentrum GmbH; Michael Schmidt, Univ. of Erlangen-Nuremberg, Chair of Photonic Technologies Welding of White Thermoplastics with Adapted Wavelengths (603) Viktor Mamuschkin, Mirko Aden, Arnold Gillner, Alexander Olowinsky, Fraunhofer Institute for Laser Technology (ILT) Quasi-Simultaneous Laser Welding of Transparent Polymers by Using Beam Off-Setting Scanning Technique (604) Saara Ruotsalainen, Petri Laakso, Veli Kujanpää, VTT Technical Research Centre of Finland Butt Welding of Transparent Polyamide (Pa11) with 1.9µm Fiber Laser (605) Petri Laakso, Saara Ruotsalainen, Veli Kujanpää, VTT Technical Research Centre of Finland; Alexander Olowinsky, Gerhard Otto, Fhg ILT

LMP Session 5: Cutting Tuesday, October 8th • 8:30 AM

Session Chair: Dirk Petring, Fraunhofer ILT, Aachen, Germany Parameter Tolerance Evaluation When Laser Cutting in Decommissioning Applications (501) Paul Hilton, TWI Ltd. A Comparative Experimental Study of Laser Fusion Cutting of Steel with 1 Micron and 10 Microns Laser Wavelengths (502) Koji Hirano, Nippon Steel & Sumitomo Metal Corporation; Remy Fabbro, PIMM Laboratory, Arts et Métiers ParisTech - CNRS Energy Conditions of a High-Quality Cut at the Laser-Oxygen Cutting with Fiber and CO2 Lasers (503) Anatoly Orishich, Institute of Theoretical and Applied Mechanics, Russian Academy of Sciences, Alexander Malikov, Victor Shulyatyev, Alexander Golyshev, Institute of Theoretical and Applied Mechanics Analysing the Temperature Distribution at the Cutting Front and Inside the Cutting Kerf During CO2-Laser Cutting of Aluminium (504) Thomas Graf, Michael Jarwitz, Rudolf Weber, IFSW, Univ. of Stuttgart The Novel Technology for Thick Glass Cutting with Small Power Laser Saw (505) Jimin Chen, Chao Huang, Institute of Laser Engineering, Beijing Univ. of Technology


LMP Session 7: Drilling Tuesday, October 8th • 10:40 AM

Session Chair: Noemie Dury, ROFIN-LASAG AG, Thun, Switzerland Determination of the Bore Hole Diameter by Analyzing Process Emissions (701) Stefan Janssen, Hermann Uchtmann, Ingomar Kelbassa, RWTH Aachen Univ. Cax Process Chain for Laser Drilling of Tool Molds (702) Ingomar Kelbassa, Hermann Uchtmann, RWTH Aachen Univ. Research on Laser Drilling in Diverse Modes by ns Pulse Laser (703) Xiaobing Zhang, Beijing Aeronautical Manufacturing Technology Research Institute A Better Understanding of the Laser Drilling Process using Numerical Simulation Based on Cnem (704) Jeremie Girardot, PIMM Laboratory (CNRS)

Program Committee: Magdi Azer, GE Global Research, Niskayuna, NY, USA Milan Brandt, RMIT Univ., Bundoora, Victoria, Australia Paul Denney, Lincoln Electric Company, Cleveland, OH, USA Hardus Greyling, CSIR National Laser Center, Pretoria, Republic of South Africa Koji Hirano, Nippon Steel Corporation, Chiba, Japan Seiji Katayama, Osaka Univ., Ibaraki, Osaka, Japan Ingomar Kelbassa, RWTH Aachen Univ., Aachen, Germany Wolfgang Knapp, CLFA Fraunhofer ILT, Paris, France Markus Kogel-Hollacher, P  recitec Optronik GmbH/Precitec KG, Rodgau, Germany Lin Li, The Univ. of Manchester, Manchester, Great Britain William O'Neill, Univ. of Cambridge, Cambridge, Great Britain Juan Pou, Univ. de Vigo, Vigo, Spain Michael Rethmeier, BAM, Berlin, Germany Antti Salminen, L  appeenranta Univ. of Technology, Lappeenranta, Finland Rudolf Weber, IFSW, Univ. of Stuttgart, Stuttgart, Germany

[email protected]


Laser Materials Processing Conference LMP Session 8: Beam and Material Characterization Tuesday, October 8 • 10:40 AM th

Session Chair: Thomas Kugler, Laser Mechanisms, Inc., Novi, MI, USA The Full Spectrum Absorptance of Engineering Grade Metals with Diverse Surface Appearances (801) Dongyun Zhang, Heng Zhao, Rui Wu, Dongyun Zhang, Congyang Li, Institute of Laser Engineering, Beijing Univ. of Technology Identification of the Zinc Dispersion in Rubber Blends by Libs with a Nd:Yag Laser (803) Benjamin Emde, Jörg Hermsdorf, Stefan Kaierle, Ludger Overmeyer, Laser Zentrum Hannover e.V. Non-Disruptive, Low Loss In-Line Laser Beam Monitoring System for Industrial Laser Processing (804) Gilbert Haas, Michael Scaggs, HAAS Laser Technologies

LMP Session 9: Hybrid Welding

Improvement and Understanding of Surface Finish Obtained with the Direct Metal Deposition Technique (1004) Muriel Carin, Denis Carron, Philippe Le Masson, Simon Morville, Limatb, Univ. of South Brittany; Remy Fabbro, Myriam Gharbi, Cyril Gorny, Patrice Peyre, PIMM, UMR 8006 CNRS - Arts et Métiers ParisTech A View on using High Power Lasers for Slm Technology (1005) Sozon Tsopanos, TWI Ltd. Experimental Analysis of the Influence of Process Parameters on the Melt Pool Formation and Stability in Powder Bed Laser Melting (1006) Runchen Cao, Stamp, Kevin Verdier, Arts et Métiers ParisTech; Pascal Aubry, Cea Saclay Design Approaches for Functionally Adapted and Individualized Components Made by SLM (1007) Christian Hinke, Fraunhofer Ilt; Simon Merkt, Rwth Aachen Univ.

LMP Session 11: Welding I Wednesday, October 9th • 8:30 AM

Tuesday, October 8th • 1:30 PM

Session Chair: Annett Klotzbach, Fraunhofer IWS, Dresden, Germany A Study of High Power Fiber-Laser-Tig-Hybrid Welding of Low Alloyed Steel (901) Seppo Leppänen, Antti Salminen, Lappeenranta Univ. of Technology Induction Assisted Gma-Laser Hybrid Welding of High-Strength Fine- Grain Structural Steels (902) Mareike Collmann, Peter Schaumann, Institut Fuer Stahlbau; Stefan Kaierle, Rabi Lahdo, Oliver Seffer, Laser Zentrum Hannover e.V.; Bernard Nacke, Jörg Neumeyer, Holger SchüLbe, Institut Fuer Elektroprozesstechnik Effect of Tig Arc on Plume Induced in Fiber Laser Welding (903) Fei Li, Rongshi Xiao, Beijing Univ. of Technology Hybrid Laser Welding of Cladded Tube (904) Frederic Coste, PIMM, UMR 8006 CNRS Hybrid Laser Welding of Single Sided Fully Penetrated Fillet Welds (905) Wojciech Suder, Stewart Williams, Josef Camilleri, Cranfield Univ. Study of Filler Metal Mixing and Its Implication on Weld Homogeneity of Laser-Hybrid and Laser Cold-Wire Welded Thick Austenitic Stainless Steel Joints (906) Miikka Karhu, Veli Kujanpää, VTT Technical Research Centre of Finland; Andrey Gumenyuk, Marco Lammers, Bam - Federal Institute for Materials Research and Testing Laser-Cold Metal Transfer Arc Hybrid Welding of Dissimilar Metals (907) Ming Gao, Cong Chen, Xiaoyan Zeng, Huazhong Univ. of Science & Technology

LMP Session 10: Laser Assisted Machining I Tuesday, October 8th • 1:30 PM

Session Chair: Minlin Zhong, Tsinghua Univ., Beijing, People's Republic of China Sensor System for Spatially Resolved Observation of the Melt Pool in Selective Laser Melting (1001) Ulrich Thombansen, Fraunhofer Institute for Laser Technology ILT; Andrei Diatlov, RWTH Aachen Univ. Numerical Simulation and Experimental Investigation of ThreeDimensional Gas-Jet Transportation of Powder Particles in Direct Material Deposition (1002) Irina Kovaleva, Igor Smurov, Dipi Laboratory; Oleg Kovalev, Alexander Zaitsev, Khristianovich’s Institute of Theoretical and Applied Mechanics; Pascal Aubry, Rezak Mezari, Thierry Malot, Kevin Verdier, STAMP, Arts et Métiers ParisTech Characterisation of Thermal Profile of Parts Made from Selective Laser Melting (Slm) (1003) Tim Slingsby, Monash Univ.

Session Chair: Veli Kujanpää, VTT Technical Research Centre of Finland, Lappeenranta, Finland Simultaneous Top and Root High Speed Imaging on Droplet Formation in Laser Welding (1101) Ingemar Eriksson, Torbjörn Ilar, Alexander Kaplan, Luleå Univ. of Technology Laser Welding of NiTi to Stainless Steels (1102) Edwin Mok, Univ. of Nottingham Ningbo China; H.C. Man, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic Univ. Suppression on Porosity for Laser Welding of Pure Nickel and Stainless Steel (1103) Xudong Zhang, Nobuaki Kobayashi, Yasuhiro Motegi, Norihiro Yade, Hitachi Automotive Systems, Ltd. Wire Transfer Stability and Its Prediction in Laser Hot Wire Welding (1104) Shiqing Zheng, Peng Wen, Jiguo Shan, Zhenhua Feng, Tsinghua Univ. Detection and Repairing of Weld Defects (1105) Peter Berger, Timo Bauknecht, Meiko Boley, Felix Abt, Rudolf Weber, Thomas Graf, IFSW, Univ. of Stuttgart

LMP Session 12: Laser Assisted Machining II Wednesday, October 9th • 8:30 AM

Session Chair: Amelia Almeida, Instituto Superior Tecnico, Lisbon, Portugal Laser-Based Fabrication with Ti- and Ni-Base Superalloys (1201) Christoph Leyens, Frank Brueckner, Thomas Finaske, Steffen Nowotny, Eckhard Beyer, Fraunhofer IWS; Sebastian Thieme, Tu Dresden Laser-Based Generation of Precise Functional Structures and Components (1202) Frank Brueckner, Mirko Riede, Thomas Finaske, Steffen Nowotny, Fraunhofer IWS Dresden; Christoph Leyens, Eckhard Beyer, Fraunhofer Iws Dresden / Technische Universitaet Dresden Integrated Rapid 3D Mapping and Laser Additive Repair of Gas Turbine Engine Components (1203) Lijue Xue, Yangsheng Li, Jianyin Chen, Shaodong Wang, Glen Campbell, National Research Council Canada; Matt Donovan, United Technologies Aerospace Systems Optimization of the Laser Direct Metal Deposition Process in 5-Axis Configuration. (1204) Didier Boisselier, Simon Sankare, IREPA Laser Synthesis and Characterization of Fe-Based Metallic Glass Composite by Laser Direct Deposition (1205) Xiaoyang Ye, Yung Shin, Purdue Univ.

LMP Session 13: Welding II Wednesday, October 9th • 10:30 AM

Session Chair: Antti Salminen, Lappeenranta Univ. of Technology, Lappeenranta, Finland



[email protected]

Laser Materials Processing Conference Indirect Measurement of Keyhole Pressure Oscillations during Laser Deep Penetration Welding (1301) Joerg Volpp, Daniel Freimann, BIAS GmbH The Selection of Fiber Laser Mode Characteristics for Manufacturability in Laser Welding (1302) Daniel Capostagno, SPI Lasers LLC Ultra-Narrow Gap Welding of Heavy Section Stainless Steel with High Power Fiber Laser (1303) Guowei Zhang, Rongshi Xiao, Beijing Univ. of Technology Laser Beam Welding in Vacuum of Thick Plate Structural Steel (1304) Stefan Jakobs, Welding and Joining Institute, RWTH Aachen Univ. Microstructure and Mechanical Property of Laser and Electron Beam Welded 25 mm Thick A516 Gr.70 Steel Joints (1305) James Chen, Andrew Laver, Natural Resources Canada Understanding the Weld Phenomena Associated with Continuous Wave and Quasi Continuous Wave Fiber Lasers in the Intermediate Power Range (1306) Tony Hoult, IPG Photonics Silicon Valley Technology Center

LMP Session 14: Laser Assisted Machining III Wednesday, October 9th • 10:30 AM

Session Chair: M. Angeles Montealegre, AIMEN- Centro Tecnológico, Porriño, Spain Direct Metal Deposition of Functional Graded Materials (1401) Jose M. Amado, Javier N. Montero, Marĩa J. Tobar, Armando Yanez, Universidade da Coruna Measurement of Particle Density Distribution of Powder Nozzles for Laser Material Deposition (1402) Stefan Mann, Fraunhofer Institute for Laser Technology (ILT) Multi-Beam Laser Additive Manufacturing (1403) Hans Herfurth, Rahul Patwa, Fraunhofer Center for Laser Technology (ILT); Jyoti Mazumder, Josh Chae, Univ. of Michigan Embedding Fibre Optic Sensors into Metallic Structures Using Laser Additive Manufacturing (1404) Dirk Havermann, Robert R.J. Maier, William N. Macpherson, Duncan P. Hand, Heriot-Watt Univ. Automated Laser Metal Deposition Welding in the Field of Tool and Mould Making (1405) Jean- Pierre Bergmann, Tu Ilmenau; Jens Bliedtner, Markus Franz, Conrad Haupt, Univ. of Applied Sciences Jena Direct Metal Deposition of Titanium Matrix Composites: Optimization of the Process and Microstructural Analysis (1406) Sebastien Poutet, Laboratoire PIMM

LMP Session 15: W  elding of Non-Ferrous Materials I Wednesday, October 9th • 3:00 PM

Session Chair: Paola De Bono, TWI Ltd, Cambridge, Great Britian Remote Laser Welding of Multi-Alloy Aluminum in Different Joining Geometries (1501) Daniel Weller, Peter Stritt, Thomas Graf, Rudolf Weber, IFSW, Univ. of Stuttgart; Cyrille Bezencon, Novelis Switzerland Sa Laser Micro Welding of Aluminum with the Superposition of a Pulsed Diode Laser and a Pulsed Nd:Yag Laser (1502) Philipp von Witzendorff, Lorenz Gehrmann, Stefan Kaierle, Ludger Overmeyer, Laser Zentrum Hannover e.V.; Martin Bielenin, Jean-Pierre Bergmann, Ilmenau Univ. of Technology Analysis of Laser Welding of Different Aluminum Alloys (1503) Osbaldo MartíN Galicia Gutierez, Dirk Frederik De Lange, Ricardo Romero Mendez, Universidad Autonoma De San Luis Potosi, Facultad De Ingenieria, Ciep; Bernard J. Aalderink, Demcon Research on Deformation and Performance Control Technologies on Laser Welding of Integral Panel of 2524/7150 Aluminum Alloy (1504) Dong Bizhe, Beijing Univ. of Technology


Effects of Dual-Beam Laser Welding and Pulse Shaping on Cracking Susceptibility of Aa 5754 Aluminum (1505) Jean Pierre Bergmann, Martin Bielenin, Martin Stambke, Ilmenau Univ. of Technology Laser Narrow-Gap Welding of Hot Crack Sensitive Thick Aluminum Plates (1506) Renald Schedewy, Berndt Brenner, Dittrich Dirk, Fraunhofer Institute for Material and Beam Technology; Eckhard Beyer, Fraunhofer Institute for Material and Beam Technology, Univ. of Technology Dresden

LMP Session 16: Surface Modification Wednesday, October 9th • 3:00 PM

Session Chair: Ingomar Kelbassa, RWTH Aachen Univ., Aachen, Germany Systems Engineering for Laser Heat Treatment (1601) Eckhard Beyer, Steffen Bonss, Berndt Brenner, Jan Hannweber, Udo Karsunke, Stefan Kuehn, Dirk Poegen, Marko Seifert, Fraunhofer IWS Microstructure and Corrosion Resistance of Laser Alloying Coating In-Situ Synthesized on Ductile Iron (1602) Qiwen Wu, Mingxing Ma, Weiming Zhang, Wenjin Liu, Cunyuan Peng, Tsinghua Univ. NiAl Intermetallic Compound Coating Prepared by Supersonic Cold Spraying and Laser Heating and Its Anti-Cavitation Performance (1603) Zhihong Li, Chenhua Lou, Fanzhi Kong, Jianhua Yao, Research Center of Laser Processing Technology and Engineering, Zhejiang Univ. of Technology Laser Cleaning of Carbonaceous Deposits on Combustion Engine Components (1604) Yingchun Guan, Gnian Cher Lim, Hong Yu Zheng, Singapore Institute of Manufacturing Technology; Ming Hui Hong, National Univ. of Singapore Study on the Friction and Wear Behavior of Laser Surface Strengthened Railway Steel (1605) Yinlan Zheng, Qianwu Hu, Xiaoyan Zeng, Huazhong Univ. of Science and Technology Laser Transformation Hardening of Steel Sheets (1606) Hyungson Ki, Sangwoo So, Sanseo Kim, Ulsan National Institute of Science and Technology

LMP Session 17: Cladding I Wednesday, October 9th • 3:00 PM

Session Chair: Dongyun Zhang, Beijing Univ. of Technology, Beijing, People's Republic of China Dynamic Observation of Formation Process in Laser Cladding Using High Speed Video Camera (1701) Nobuyuki Abe, Daichi Tanigawa, Masahiro Tsukamoto, Yoshihiko Hayashi, Hiroyuki Yamazaki, Joining and Welding Research Institute, Osaka Univ.; Yoshihiro Tatsumi, Mikio Yoneyama, Osaka Fuji Corporation A Study on Attenuation of a Nd:Yag Laser Power by Co-Axial and Off-Axial Nozzle Powder Stream During Cladding (1702) Wei Ya, M2i; Federico Hernandez Sanchez, Pathiraj Belavendram, Bert Huis In't Veld, Utwente A Highly Versatile Novel Technique Based on Laser Cladding to Produce Coatings in the Micrometer Range (1703) Jesus Del Val, Fernando Lusquiñoss, Rafael Comesaña, Antonio Riveiro, Felix Quintero, Juan Pou, Univ. of de Vigo Clad Height Control in Laser Cladding Using a Nonlinear Optimal Output Tracking Controller (1704) Mohammad Farshidianfar, Amir Khajepour, Saeid Khosravani, Adrian Gerlich, Univ. of Waterloo Microstructure and Properties of FeCrNiCoMn High-Entropy Alloy Coating Prepared by Laser Cladding (1705) Jianhua Yao, Ziqing Weng, Lijing Yang, Gang Dong, Zhejiang Univ. of Technology

[email protected]


High Speed Tube/Stent Cutting System

VersaSTC -Two, Three, or Four Axis -Wet or Dry Cut Options -Fiber & Ultrafast Laser Integration -Integrated Bushing & Gripper Assembly -Containment Cutting Box with Finished Part Drawer -Precision Aerotech Motion -Isolated Granite Structure Workstation Overview: • • • • •

System Footprint for two-axis system: 62” x 32” x TBD (Height based on laser configuration) Welded, square steel tubing main frame with granite motion/optics mounting structure secured via isolation mounts CRDH Class I (CDRH Class IV option) Electrical enclosure integral to system main frame Industrial PC and UPS Rack mounted in frame

digital Encoder Technology from SCANLAB

NEW: intellicube® 14 More information at:

The key to high-precision laser applications: galvos with digital encoders dynAXISse®


• For 10-30 mm apertures • Digital encoders with minimal-inertia sensors • Ultra-low drift and dither • Position resolution up to 18 bit

• For 14-30 mm apertures • Highest-resolution digital encoders • Lowest drift and dither • Position resolution up to 20 bit

If you’re seeking precise and reliable high-performance scan solutions, then contact us at [email protected]



[email protected]

Laser Materials Processing Conference Research on Mechanical Electronic Runout and Residual Stress of Laser Cladding Layer on Large-Scale Rotary Component (1706) Shirui Guo, Qunli Zhang, Jianhua Yao, Research Center of Laser Processing Technology and Engineering, Zhejiang Univ. of Technology; Haiming Lai, Hangzhou Steam Turbine Co.,Ltd

LMP Session 18: Welding of Non-Ferrous Materials II Thursday, October 10th • 8:30 AM

Session Chair: Ali Khan, TWI Ltd, Cambridge, Great Britain Welding of Dissimilar Metallic Materials Using a Scanned Laser Beam (1801) Sullivan Smith, Jonathan Blackburn, Paola De Bono, Paul Hilton, TWI Ltd Investigation on the Laser Welding Process of Tin Phosphor Bronze (1802) Hui-chi Chen, Guijun Bi, Mui Ling Sharon Nai, Jun Wei, Singapore Institute of Manufacturing Technology Effect of Process Parameters on Pore Formation in Laser Welding of AZ31B Magnesium Alloy in Lap Joint Configuration (1803) Masoud Harooni, Southern Methodist Univ.-RCAM Laser Processing of Thin Copper and Aluminium Thin Sheets with Green (532nm) and Infrared (1064nm) Pulsed Laser Beam Sources (1804) Jon Blackburn, Paola De Bono, Ioannis Metsios, TWI Ltd Dissimilar Joining of Titanium Alloy Ti-6Al-4V to Aluminum Alloy 2024 Via Laser Welding (1805) Vittorio Alfieri, Fabrizia Caiazzo, Vincenzo Sergi, Univ. of Salerno

LMP Session 19: Processing of CFRP Thursday, October 10th • 8:30 AM

Session Chair: Saara Ruotsalainen, VTT Technical Research Centre of Finland, Lappeenranta, Finland High-Efficiency Laser Processing of Cfrp (1901) Rudolf Weber, Volkher Onuseit, IFSW, Simon Tscheulin, Markus Grafried, Thomas Graf, IFSW, Univ. of Stuttgart The Dependence of Cutting Carbon Fiber Reinforced Plastics with the Laser on the Laser Wavelength and Oxygen Concentration of the Air (1902) Shin-Ichiro Masuno, Kazuya Miyagawa, Kazuki Nakai, Kenjiro Takahashi Yuji Sato, Masahiro Tsukamoto, Tatsuya Nariyama, Kinki Univ. Macro Structuring of Composite Material by UV-Laser Ablation (1903) Hagen Dittmar, Peter Jaeschke, Ludger Overmeyer, Oliver Suttmann, Laser Zentrum Hannover e.V. Correlation of Interlaminar and Tensile Properties with Resulting Thermal Impact While CFRP Laser Processing (1904) Peter Jaeschke, Laser Zentrum Hannover e.V. Investigations on Processing of Carbon Fiber Reinforced Plastics Using Ultrashort Pulsed Laser Radiation with High Average Power (1905) Johannes Finger, Marco Weinand, Dirk Wortmann, Chair for Laser Technology, RWTH Aachen Univ. Investigations of Multi-Wavelengths Treatment at Composite Materials (1906) Annett Klotzbach, Andreas Fuerst, Fraunhofer IWS Study of Carbon-Fiber-Reinforced Polymer Under Moderate Laser Intensity Application to Laser Drilling (1907) Laurent Berthe, Frederic Coste, Frederic Vales, CNRS - Arts et Metiers/Lab PIMM Optimization of Laser Parameters for Structural Bonding of CFRP Components with Paste Adhesive (1908) Deniz Ozel, Lale Sacan, Basak Basarir, Ayhan Kilic, Aysun Dogangun Akin, Turkish Aerospace Industries, Inc. The Damage Characteristics and Mechanism of CFRP during Laser Joining of CFRP/Mild Steel Dissimilar Joint (1909) Xianghu Tan, Jiguo Shan, Jialie Ren, Tsinghua Univ.; Jing Zhang, Shanglu Yang, General Motors (China) Investment Company Limited


LMP Session 20: Cladding II Thursday, October 10th • 8:30 AM

Session Chair: Milan Brandt, RMIT Univ., Bundoora Victoria, Australia Laser Cladding using a Scanning Optics - Effect of Powder Feeding Angle and Powder Feeding Gas Flow to Process Stability (2001) Iikka Pekkarinen, Antti Salminen, Jarmo Ilonen, Lasse Lensu, Lappeenranta Univ. of Technology; Veli Kujanpää, Vtt Technical Research Centre of Finland Microstructure Control During Laser Deposition of Nickel-Based Superalloy Ds Rene80 (2002) Dongyun Zhang, Beijing Univ. of Technology; Heng Zhao, Zhibo Li, Tiechuan Zuo, Institute of Laser Engineering, Beijing Univ. of Technology Optimization of the Process Parameters in High Power Direct Diode Laser Cladding of Aisi H13 Tool Steel Using Response Surface Methodology (2003) Parisa Farahmand, Prabu Balu, Sayeed Mohammed, Radovan Kovacevic, Southern Methodist Univ. Research of Ceramic Coating Prepared by Pulsed Laser Cladding in Different Assembly Way for Ultra-Fine Powder (2004) Qunli Zhang, Zhejiang Univ. of Technology; Volodymyr Kovalenko, Laser Technology Research Institute, National Technical Univ. of Ukraine; Jianhua Yao, Research Center of Laser Processing Technology and Engineering, Zhejiang Univ. of Technology Nano-Second Pulsed Laser Cladding of Uranium (2005) Yongbin Zhang, China Academy of Engeering Physics The Effect of Minor Alloying Elements of Alloy 625 on the Laser Cladding Process (2006) Jonne Näkki, Tampere Univ. of Technology Laser Cladding of M3:2 High Speed Steel Powder on 304 Steel Substrate (2007) Guifang Sun, Jiangsu Univ.; Yongkang Zhang, Southeast Univ.; Rui Zhou, Jiangsu Univ. of Science and Technology System Identification and Height Control of Laser Cladding Using Adaptive Neuro-Fuzzy Inference Systems (2008) Mohammad Farshidianfar, Amir Khajepour, Adrian Gerlich, Univ. of Waterloo; Meysar Zeinali, Univ. of Laurentian Microstructure and Oxidation Performance of Laser Cladding MCrAlY Coatings on an Austenitic Stainless Steel Substrate (2009) Jose M. Amado, Javier N. Montero, Maria J. Tobar, Armando Yanez, Universidade da Coruna; Vicente Amigo, Universidad Politecnica De Valencia

LMP Session 21: W  elding High Strength Steel (HSS) Thursday, October 10th • 10:40 AM

Session Chair: Markus Kogel-Hollacher, Precitec Optronik GmbH/Precitec KG, Rodgau, Germany Laser-Welded-Steel-Floor-Panel for Marine Container (2101) Jukka Siltanen, Rautaruukki Oyj; Ilpo Maaranen, Ville-Matti Nurmela, Ruukki Metals Oy Study on Powder Delivery and Process Optimization in Laser Welding of High Strength Galvanized Steel with Powder Filling (2102) Yi Zhang, Hunan Univ. Laser Welding of Fully Austenitic Twinning Induced Plasticity (Twip) Steels (2103) Velten Behm, Volkswagen AG; Stefan Huinink, Sitech Sitztechnik GmbH, Andre Springer, Stefan Kaierle, Laser Zentrum Hannover e.V. Measuring the Influence of Laser Welding on Fatigue Crack Propagation in High Strength Steel (2104) Jesper Sundqvist, Karl-Gustaf Sundin, Ingemar Eriksson, Jan Granstrom, Alexander F.H. Kaplan, Lulea Univ. of Technology, Department of Engineering Sciences and Mathematics; Markku Keskitalo, Kari Mantyjarvi, Univ. of Oulu, Oulu Southern Institute

[email protected]


Laser Microprocessing Conference Conference Chair: Henrikki Pantsar, Cencorp Corporation, Salo, Finland The Laser Microprocessing Conference will present an in-depth view into the evolving world of micro-scale laser applications, processes and equipment. Development in these fields is always fast-paced and the ICALEO® congress is the place to visit to see and hear the state of the art in applied research, meet with leading experts and gain knowledge of development trends. Technologies presented in this conference will be the drivers for efficient manufacturing and sustainable growth in the future. The Laser Microprocessing Conference comprises more than 50 technical and invited papers. The importance of laser surface engineering and additive manufacturing is increasing and new laser sources and optical concepts have been developed for more cost efficient manufacturing and better quality. In addition, other aspects of micromachining and joining as well as physical interactions and monitoring solutions are well covered. Overall, the Laser Microprocessing Conference offers a balanced mixture of innovation, science and technology transfer, setting the stage for an exciting ICALEO® congress, full of enthusiasm, leading edge technology and networking.

LMF Session 1: J oint Session with Nano Monday, October 7


• 1:30pm

Session Co-Chairs: Yongfeng Lu, Univ. of Nebraska-Lincoln, Lincoln, NE, USA; Henrikki Pantsar, Cencorp Oyj, Salo, Finland Micro Scale Laser Based Additive Manufacturing for Metals (M101) Konrad Wisenbach, Fraunhofer ILT Laser Printing for Micro and Nanomanufacturing (M102) Philippe Delaporte, UMR 7341 CNRS Aix-Marseille Université

LMF Session 2: O  ptics and Beam Delivery Monday, October 7th • 3:20pm

Session Chair: Corey Dunsky , Aeos Consulting, Inc., Los Gatos, CA, USA Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process (M201) Christian Fornaroli, Arnold Gillner, Jens Holtkamp, Fraunhofer ILT Parallel Femtosecond Laser Processing Using Intensity Modulated Diffraction Pattern Produced with Spatial Light Modulator (M202) Jarno Kaakkunen, Petri Laakso, VTT Technical Research Centre of Finland; Martti Silvennoinen, Kimmo Pälväsaari, Pasi Vahimaa, Univ. of Eastern Finland, Department of Physics and Mathematics

Program Committee: Neil Ball, Directed Light Inc., San Jose, CA, USA Masayuki Fujita, Institute for Laser Technology, Osaka, Japan Jack Gabzdyl, SPI Lasers, Southampton, Great Britain Sami Hendow, Adaptive Laser Processing, Los Altos, CA, USA Aravinda Kar, CREOL, The College of Optics and Photonics, Univ. of Central Florida, Orlando, FL, USA Nam Seong Kim, EO Technics, Anyang, South Korea Petri Laakso, VTT, Lappeenranta, Finland Michael Mielke, Raydiance, Inc., Petaluma, CA, USA Eric Mottay, Amplitude Systemes, Pessac, France Yasuhiro Okamoto, Okayama Univ., Okayama, Japan Alexander Olowinsky, Fraunhofer ILT, Aachen, Germany Yasu Osako, ESI, Portland, OR, USA Michael Schmidt, Bayerisches Laserzentrum GmbH, Erlangen, Germany Sascha Weiler, TRUMPF Inc., Farmington, CT, USA Bodo Wojakowski, Alltec GmbH - Laser Business Unit, Selmsdorf, Germany Xiaoyan Zeng, Huazhong Univ. of Science & Technology, Wuhan, People’s Republic of China



High Throughput Surface Structuring with Ultrashort Pulses in Synchronized Mode with Fast Polygon Line Scanner (M203) Ronny De Loor, Next Scan Technology BV; Beat Jaeggi, Beat Neuenschwander, Markus Zimmermann, Bern Univ. of Applied Sciences Engineering and Information Technology; Lars Penning, Next Scan Technology BV; Andreas Oehler, Kurt Weingareten, Time Bandwidth Products Ag High Power Fiber Optic Beam Delivery for Industrial Ultrafast Lasers (M204) Fetah Benabid, Frederic Gerome, Benoit Beaudou, Glo Photonics; Benoit Debord, Coralie Fourcade-Doutin, Xlim; Eric Mottay, Cecile Mukerjee, Anthony Pinal, Amplitude Systemes

LMF Session 3: Laser Surface Engineering Tuesday, October 8th • 8:30am

Session Chair: Nam Seong Kim, EO Technics, Anyang, South Korea Parameters of Influence in Surface Ablation of Metals with Using a High Power Tunable Ultrafast Laser (M303) John Lopez, Univ Bordeaux; Remi Torres, Marc Faucon, ALPhANOV; Yoann Zaouter, Clemens Hoenninger, Eric Mottay, Amplitude Systemes; Patrick Georges, Marc Hanna, Institut Optique Graduate School Structuring Features of Micro- and Nano-Ripples Induced by Oblique Incident Linear Polarized Femtosecond Laser Irradiating Metal Surface (M304) Xiang Ming Dong, Haiying Song, Shibing Liu, Institute of Laser Engineering, Beijing Univ. of Technology Sequential Colorization of Steel Surface by ps Laser Texturing (M305) Dun Liu, Zheng Kuang, Leigh Mellor, Walter Perrie, Stuart Edwardson, Geoff Dearden, Ken Watkins, Univ. of Liverpool

LMF Session 10: M  icromachining I Tuesday, October 8th • 10:40am

Session Chair: Yasu Oasko, ESI, Portland, OR, USA Comparison Between Laser Technologies and Alternative Processes on Paint and Polymer Layer Removal on Composite Substrate (M1001) Charly Loumena, Anthony Kirsch, Rainer Kling, ALPhANOV Experimental Investigation of Cfrp Ablation with UV and N-IR Nanosecond Lasers (M1002) Yuji Sato, Masahiro Tsukamoto, Kazuki Nakai, Tatsuya Nariyama, Kinki Univ.; Kenji Takahashi, Shin-Ichiro Masuno, Joining and Welding Reserach Institute, Osaka Univ. High Aspect Ratio Holes Laser Drilling in Mo with Picosecond Laser (M1003) Jing Jiang, Meng Chen, Chao Yang, Zhenxu Bai, Gang Li, Beijing Univ. of Technology From fs - ns: Influence of the Pulse Duration Onto the Material Removal Rate and Machining Quality for Metals (M1004) Beat Jaeggi, Benjamin Lauer, Beat Neuenschwander, Marc Schmid, Bern Univ. of Applied Sciences Engineering and Information Technology

[email protected]

Laser Microprocessing Conference

Non-Dimensional Evaluation of Nonlinear Absorptivity in Internal Modification of Glass Using USLP (M1005) Isamu Miyamoto, Osaka Univ.; Kristian Cvecek, Bayerisches Laserzentrum; Michael Schmidt, Univ. Erlangen-Nuremberg Effects of Polarization on Laser Diffusion and Materials Modification (M1006) Sen-Yong Chen, Aravinda Kar, The College of Optics and Photonics, Univ. of Central Florida; Raj Vaidyanathan, AMPAC, UCF

LMF Session 4: Industrial Processes and Devices Tuesday, October 8th • 1:30pm

Session Chair: Petri Laakso, VTT, Lappeenranta, Finland High Density Through Glass Vias for Advanced Chip Packaging (M401) Ralph Delmdahl, Jan Brune, Rainer Paetzel, Rolf Senczuk, Andreas Blumenrath, Hatim Haloui, Dirk Mueller, Coherent Kaiserslautern GmbH Industrial Femtosecond Laser Systems and Applications in Precision Machining Glass and Metal (M402) Michael Mielke, Raydiance, Inc. Sapphire Cutting with Pulsed Fiber Lasers (M403) Christoph Ruettimann, LASAG AG; Noemie Dury, Colin Woratz, Rofin-Lasag Ag; Stefan Woessner, Manz Ag Beam Shaping Unit for Microprocessing on the Base of Refractive Beam Shapers (M404) Alexander Laskin, Vadim Laskin, Adloptica; Nerijus Siaulys, Gintas Slekys, Altechna Laser Micromachining of Bio-Absorbable Polymers: Impact of the Laser Process Parameters on the Machining Throughput (M405) Frank Hendricks, Victor Matylitsky, High Q Laser GmbH New Micro and Nano Laser Machining Applications with a Versatile Ultrashort Pulse Laser System and Diffractive Optical Elements (M406) Siegfried Pause, LLT Application GmbH; Ulrich Rädel, Topag Lasertechnik GmbH; Erwin Steiger, Erwin Steiger Laser Service Expansion of Pulsed Laser Process Limits Through Pulsed Fibre Lasers (M407) Ulrich Duerr, Noemie Dury, Christoph Ruettimann, Rofin-Lasag Ag; Ronald Holtz, Class 4 Laser Professionals

LMF Session 5: A  dditive Micro Processes Wednesday, October 9th • 8:30am

Session Chair: Bo Gu, BOS PHOTONICS, North Andover, MA, USA High Temperature High Pressure Micro/Nano Printing of Alsi Alloy Via Steel Mold Fabricated by ps Laser - Invited Presentation (40 Minutes) (M501) Peixun Fan, Cheng Lin, Minlin Zhong, Tsinghua Univ. Laser Microprocessing Applications on Green Energy Cell Microstructures (M502) Huan Yang, Leiming Deng, Duan Jun, Xiaoyan Zeng, Huazhong Univ. of Science and Technology Laser Selective Transfer Process of Barium Strontium Titanate (Bst) on a Sapphire Substrate (M503) Masayuki Fujita, Institute for Laser Technology; Toshihiro Somekawa, Institute for Laser Technology; Tetsuo Samoto, Hideki Hirano, Kousuke Hikichi, Shuji Tanaka, Masayoshi Esashi, Tohoku Univ. Post-Processing of Parts Produced by Additive Manufacturing Using Ultrafast Laser Radiation (M504) Ilya Mingareev, Tobias Bonhoff, Ashraf El-Sherif, Martin Richardson, Townes Laser Institute, Univ. of Central Florida; Tim Biermann, Joining Technologies Research Center; Wilhelm Meiners, Ingomar Kelbassa, Fraunhofer ILT


LMF Session 6: Microjoining Wednesday, October 9th • 8:30am

Session Chair: Geoff Shannon, Miyachi Unitek, Monrovia, CA, USA Structuring and Joining Transparent Materials with Ultra Short Pulse Lasers (M601) Panjawat Kongsuwan, Sinisa Vukelic, Y. Lawrence Yao, Columbia Univ. Remote Micro Welding with Multi-Mode and Single-Mode Fiber Lasers – a Comparison (M603) Andreas Patschger, Michael Guepner, Jens Bliedtner, Ernst-AbbeFachhochschule Jena; Jean Pierre Bergmann, Technische Universitaet Ilmenau Extension of the Process Boundaries for the Soldering of Elongated Interconnectors with a Simultaneous Energy Deposition (M604) Simon W. Britten, Wolfgang Fiedler, Alexander Olowinsky, Arnold Gillner, Fraunhofer Institute for Laser Technology ILT Laser Joining of Charge-Collection Tapes onto CIGS Photovoltaic Modules (M605) Ralf Nett, Benjamin Schoeps, Leonie Bornfeld, Manuel Joop, RuhrUniversitaet Bochum, Applied Laser Technology; Kerstin Kowalick, Andreas Ostendorf, Ruhr-Universitaet Bochum, Applied Laser Technology; Christoph Ruettimann, Rofin-Lasag AG

LMF Session 7: Novel and Emerging Applications Wednesday, October 9th • 10:30am

Session Chair: Sami Hendow, Adaptive Laser Processing, Los Altos, CA, USA Singulation of Semiconductor Package by Superposition of Pulsed Fiber Laser and Green Yag Laser (M703) Yasuhiro Okamoto, Kento Shirasaya, Ryoji Kitada, Akira Okada, Okayama Univ. Trans-Wafer Processing of Semiconductors with Nanosecond Mid-Ir Laser Radiation (M704) Ilya Mingareev, Tobias Bonhoff, Nils Gehlich, Ashraf El-Sherif, Christian Gaida, Martin Gebhardt, Pankaj Kadwani, Lawrence Shah, Townes Laser Institute, Univ. of Central Florida Localized CO2 Laser Smoothing of Micro-Defects on EUV Ti-Doped Silica Substrates (M705) Alain Cournoyer, Eric Savard, Martin Briand, Yan Duval, INO Investigation of the Cutting Performance of Laser Dressed Metal Bonded Diamond Blades - Invited Presentation (M706) Philipp von Witzendorff,; Oliver Suttmann, Ludger Overmeyer, Laser Zentrum Hannover e.V.; Lutz Rissing, Manuel Stompe, Leibniz Univ. Hanover

LMF Session 8: M  icromachining II Wednesday, October 9th • 3:00pm

Session Chair: Rainer Kling, ALPhANOV, Talence Cedex, France Pico - and Femtosecond Laser Processing: Fundamentals, Market Requirements and System Solutions (40 min) (M801) Roland Mayernofer, ROFIN-BASEL Lasertech GmbH & Co. KG Processing Various Sensible High-Tech Materials with Short and Ultra-Short Pulsed Disc Laser Sources (M807) SMarkus Roehner, Susanna Friedel, Klaus Stolberg, Jenoptik Laser GmbH Analysis of Material Removal on Metallic Materials by Pulsed Fiber Lasers (M804) Mark Brodsky, SPI Lasers Robustness of the Laser Melting Process (M805) Heiko Bruening, (BIAS) - Bremer Institut Fuer Angewandte Strahltechnik GmbH Ultrashort Pulse Laser Micromachining for Mobile Display Manufacturing (M806) Eric Mottay, Amplitude Systemes; Jiyeon Choi, Sung-Hak Cho, Korean Institute of Machinery and Materials; Arnaud Zoubir, ALPhANOV

[email protected]


Laser Microprocessing Conference

Student Paper Award Contest

LMF Session 9: L aser Micro Processing Analysis and Modeling

Sponsored by:

Thursday, October 10th • 8:30am

Session Chair: Yasuhiro Okamoto, Okayama Univ., Okayama, Japan Precise Scribing of Thin Film Solar Cells by a Picosecond Laser (M901) Xin Zhao, Yunfeng Cao, Yung Shin, Purdue Univ. 3D Finite Element Modeling of Laser-Assisted Maskless Micro-Deposition (M902) Amir Azhari, Elahe Jabari, Ehsan Toyserkani, Univ. of Waterloo Experimental and Numerical Investigation on Short Pulsed Laser Welding of Stainless Steel Foils (M903) Hui-chi Chen, Singapore Institute of Manufacturing Technology Estimation of Crack Depth in Laser Scribing of Glass by Analyses with Fem and Bem (M904) Etsuji Ohmura, Keisuke Yahata, Takahiro Hirano, Osaka Univ.; Seiji Shimizu, Mitsuboshi Diamond Industrial Co., Ltd. Maximizing Laser Ablation Efficiency of Silicon Through Optimization of the Temporal Pulse Shape (M905) Alain Cournoyer, David Gay, Yves Taillon, INO; Pascal Turbis, CRM - Universite de Montreal; Emmanuel Lorin De La Grandmaison, Carleton Univ.; Claude Le Bris, ENPC

Announcing the 15th Annual ICALEO® Student Paper Award! LIA appreciates the importance of student contributions

to ICALEO by offering the opportunity to have their work recognized with this award. Students with accepted papers will be judged by an international panel on the following criteria: Originality of Topic/Material presented, Scientific and Technical Merit and Presentation Quality. Professors do not judge their own student’s papers. Prize winners will be notified after the conclusion of ICALEO and will be announced through an article in the LIA TODAY newsletter featuring conference highlights. Cash awards will be presented to 1st, 2nd, 3rd place winners. Winning papers may be submitted to LIA's Journal of Laser Applications® for publication (papers will go through the peer review process).

Located at the University of Nebraska-Lincoln, the Laser-Assisted Nano Engineering (LANE) lab, led by Prof. Yongfeng Lu, is an interdisciplinary research group conducting vibrant research in laser-related nanoscience and technology. LANE conducts both fundamental and applied research aimed at understanding laser-material interactions and developing application-oriented laser techniques, including 1) Laser-assisted material synthesis, 2) Laser-assisted micro-/nano-fabrication, and 3) Laser spectroscopy. Further information is available at LANE also provides contracted research, service, and consultation, including 1) Graphene wafers, 2) Diamond coatings, 3) Coherent anti-stokes Raman spectroscopy, 4) Two-photon polymerization, 5) Optical emission spectroscopy, 6) Laser-induced breakdown spectroscopy, 7) Laser surface cleaning and texturing, and 8) laser drilling and cutting at microscales. We welcome an opportunity to work with you. Please contact Prof. Yongfeng Lu ([email protected]) to discuss your needs.



[email protected]

Nanomanufacturing Conference Conference Co-Chairs:  Yongfeng Lu, Univ. of Nebraska – Lincoln, Lincoln, NE, USA Xianfan Xu, Purdue Univ., West Lafayette, IN, USA The Nanomanufacturing Conference of ICALEO® presents nanomanufacturing papers relevant to laser technologies. Much progress has been achieved in laser direct writing, laser nanomachining and nanofabrication using ultrafast lasers and laser-assisted growth of nanostructures. This conference will highlight research in emerging nanomanufacturing technologies in 3-D micro/nanofabrication, two-photon lithography, laser synthesis and diagnostics of carbon nanomaterial, epitaxial growth of graphene for optoelectronics, nanolithography, nanoscale thermal imaging, plasmonics, surface nanostructuring, laser sintering and laserassisted growth and epitaxy. These studies encompass a variety of applications, including nanoelectronics, photonic crystals, optoelectronics, sensors and plasmonic devices. 3D Silver Nanostructures Tailored by Femtosecond Laser Irradiation as Nano Session 1: Materials Growth and Synthesis High Sensitive Probes for Surface Enhanced Raman Spectroscopy (N207) th Monday, October 7 • 3:20pm Anming Hu, Univ. of Waterloo Session Chair: Xianfan Xu, Purdue Univ., West Lafayette, IN, USA Development of the Variable Pulsewidth Mode-Locked Femtosecond Laser Plasmonic Optical Tweezer for Small Nanoparticles (N101) Using Coherent Coupling (N208) Yausuyuki Tsuboi, Graduate School of Science, Hokkaido Univ. Hiraku Yabuno, Nishiyama Yasuhiro, Minoru Yoshida, Kinki Univ. Laser Assisted Production of Calcium Phosphate Nanoparticles from Marine Nano Session 3: Fabrication of Nanodevices Origin (N102) Wednesday, October 9th • 8:30am Mohamed Boutinguiza, Jesus Del Val, Antonio Riveiro, Rafael Comesana, Fernando Session Chair: Tommaso Baldacchini, Newport Corporation, Irvine, CA, USA Lusquinos, Juan Pou, Univ. of de Vigo Laser Direct Writing of Graphene Patterns on Glasses at Ambient Condition (N301) Effect of Laser-Assisted Resonant Excitation on the Growth of Vertically Aligned Wei Xiong, Univ. of Nebraska-Lincoln Gan Nanorods (N103) P. Thirugnanam, Yongfeng Lu, Univ. of Nebraska-Lincoln Laser Fabricated Nanoantennas for Near-Field Applications (N302) Martin Reininghaus, Zhao Cao, Dirk Wortmann, Johannes Finger, Chair for Laser Nano Session 2: Nanopatterning and Nanostructuring Technology, RWTH Aachen Univ.; Thomas Taubner, 1. Institute th Tuesday, October 8 • 8:30am of Physics (Ia), RWTH Aachen Univ. Session Co-Chairs: Lin Li, The Univ. of Manchester, Manchester, Great Britain; Tft Defect Repair Using Femtosecond Laser (N303) Yongfeng Lu, Univ. of Nebraska-Lincoln, Lincoln, NE, USA Yeong Gyu Kim, LTS Sub-Wavelength Patterning of Self-Assembled Organic Monolayers Via Low Ohmic Interconnections Between Silver Nanowires Induced by Non-Collinear Optical Parametric Amplifier (N202) Femtosecond Laser Irradiation and Local Joule Heating: A Comparative Henry Helvajian, The Aerospace Corporation Study (N304) Laser Direct Writing of Graphene Patterns on Glasses at Ambient Condition (N203) Anming Hu, Univ. of Waterloo W. Xiong, Univ. of Nebraska-Lincoln; Yongfeng Lu, Univ. of Nebraska-Lincoln Nano Session 4: Laser Processing of Nanomaterials Two-Photon Polymerization with Variable Repetition Rate Bursts Wednesday, October 9th • 10:30am of Femtosecond Laser Pulses (N204) Session Chair: Henry Helvajian, The Aerospace Corporation, Los Angeles, CA, USA Tommaso Baldacchini, Newport Corporation Ultrafast Laser Fabrication of 3D Photonic Component in Flexible Glasses (N401) Manufacture Technology of Quantitative Regulation and Control the Surface Kevin Chen, Univ. of Pittsburgh Residual Stress of Film/Substrate by Laser-Induced Shock Wave (N205) Ultrashort Pulse Laser Full Cutting of Chemically Strengthened Glass TFeng Aixin, Wenzhou Univ., JiangSu Univ.; Xue Wei, Wenzhou Univ.; for Display Manufacturing (N402) Cao Yupeng, JiangSu Univ. Jiyeon Choi, Dongsig Shin, Jeong Suh, Yong-Kwon Cho, Kyung-Han Kim, Korea Institute of Machinery & Materials; Seung Hwan Paek, Chang Ho Kim, L2K Co., Ltd Program Committee: Mesenchymal Stem Cells Behaviour onto Femtosecond Laser Textured Craig Arnold, Princeton Univ., Princeton, NJ, USA Ti Alloys (N405) Tommaso Baldacchini, Newport Corporation, Irvine, CA, USA Amelia Almeida, Alexandre Cunha, Rui Vilar, Instituto Superior Tecnico; Stephan Barcikowski, Univ. of Duisburg-Essen and Center for Marie-Christine Durrieu, Omar Farouk Zouani, Universite De Bordeaux Nanointegration CeNiDE, Essen, Germany Laser Sintering Process of Ag Nanoparticle Based Ink on Polyethylene Kevin Chen, B  eijing Golden Way Scientific Co., Ltd., Beijing, Terephthalate for Printed Electronics (N403) People’s Republic of China Juan Carlos Hernandez-Castaneda, Gnian Cher Lim, H.Y. Zheng, Lok Boon Keng, Shaochen Chen, Univ. of California – San Diego, La Jolla, CA, USA Singapore Institute of Manufacturing Technology Haris Doumanidis, Univ. of Cyprus, Nicosia, VA, Cyprus Removal of Oxide Film from Copper Using a Femtosecond Laser (N404) Nick Fang, MIT, Cambridge, MA, USA Dongsik Kim, POSTECH Costas Grigoropoulos, Univ. of California – Berkeley, Berkeley, CA, USA Nano Session 5: Advanced 3D Nanomanufacturing Changzhi Gu, The Institute of Physics, Chinese Academy of Sciences, Beijing, People’s Republic of China Thursday, October 10th • 8:30am Peter Herman, Univ. of Toronto, Toronto, ON, Canada Session Chair: Kevin Chen, Beijing Golden Way Scientific Co., Ltd., Beijing, Yoshiro Ito, Nagaoka Univ. of Technology, Nagaoka, Japan People’s Republic of China Sungho Jeong, Gwangju Institute of Science and Technology, Reconfigurable Mask or Single Optical Element Based Laser Nanofabrication Gwangju, South Korea of 3D Structures (N501) Lan Jiang, Beijing Institute of Technology, Beijing, Yuankin Lin, Univ. of North Texas People’s Republic of China Advanced 3D Nanomanufacturing (N502) Yuankun Lin, Univ. of North Texas, Denton, TX, USA Xinbing Liu, Panasonic Boston Laboratory Etsuji Ohmura, Osaka Univ., Suita, Osaka, Japan 3-dimensional Laser Ablation for Functionalization of Non-planar Optical Alberto Pique, Naval Research Laboratory, Washington, DC, USA Surfaces (N503) Gernot Pomrenke, AFOSR, London, United Kingdom Roman Kleindienst, Ronald Kampmann, Stefan Sinzinger, Technische Universität Alberto Salleo, Stanford Univ., Stanford, CA, USA Ilmenau, Institut für Mikro- und Nanotechnologien Xinwei Wang, Iowa State Univ., Ames, IA, USA Yunshen Zhou, Univ. of Nebraska-Lincoln, Lincoln, NE, USA


Poster Presentation Gallery Tuesday, October 8 and Wednesday, October 9 The Poster Presentation Gallery will be featured on Tuesday and Wednesday of the conference. Join presenters Wednesday morning for breakfast and sharing of ideas. Poster Presenters will be by their posters on Wednesday morning from 7:45am – 8:30am to answer questions. Poster presentations that submit a manuscript will be included in the ICALEO® Proceedings.

High Stability Compact Diode-Pumped Multipass Mopa Slab Laser System (P101) Zhe Sun, Beijing Univ. of Technology Laser Technology:-An Efficient Drilling System. (P102) Daljeet Singh, UPES Effect of Shielding Gas Composition on CO2-Laser Welding Quality (P103) Jukka Siltanen, Rautaruukki Oyj; Ilpo Maaranen, Ville-Matti Nurmela, Sakari Tihinen, Ruukki Metals Oy Inverse Thermal Analysis of Metal Laser Welds (P104) Samuel Lambrakos, U.S. Naval Research Laboratory Mathematical Modeling of Crystal Growth and Microstructure Formation in Laser Powder Deposition of Single Crystal Superalloy (P105) Zhaoyang Liu, Shanghai Jiaotong Univ. Thin Wall Laser Deposition with Different Types of 316L Steel Particles (P106) Khalid Mahmood, National Univ. of Sciences and Technology A Simple Optical Coupling Method for Water-Jet Guided Laser Machining System (P107) Meng Li, Wenwu Zhang, Xiping Zhang, Tianrun Zhang, Ningbo Institute of Materials Technology & Engineering, Chinese Academy of Sciences Adaptive Laser Cladding System with Variable Spot Sizes (P108) Markus Kogel-Hollacher, Precitec Opttronik GmbH; Raimond Franch, Talleres Mecanicos Comas, S.L.U; Franc Lovec, Tic-Lens Laserske Tehnologije, D.O.O; Stefan Mann, Abels Peter, Fraunhofer Institute for Laser Technology Ilt; M. Angeles Montealegre, Aimen- Technology Centre; Filip Motmans, Vito Nv; Petr Palatka, Neovision S.R.O. Influence of Polarization in Picosecond Laser Processing of Cfrp (P109) Christian Freitag, Thomas Graf, Rudolf Weber, Institut fuer Strahlwerkzeuge IFSW Sub-Nanosecond All-Normal-Dispersion Mode-Locked Yb-Doped Fiber Oscillator and Its Amplifier (P111) Junjie Chi, Pingxue Li, Haowei Hu, Yifei Yao, Guangju Zhang, Chun Yang, Ziqiang Zhao, Institute of Laser Engineering, Beijing Univ. of Technology Fundamental Study of Nd:YAG Laser Beam Welding for Lower End Plug Using HT9 Alloy Cladding Tube (P112) Kihwan Kim, Soosung Kim, Hoon Song, Yoonmyeng Woo, Korea Atomic Energy Research Institute Contribution to the Replacement of Cobalt-Free Hardfacing Coating by Powder Laser Metal Deposition in Fast Neutron Reactors (P113) Van De Tran, Pascal Aubry, Nadége Caron, Cea Saclay Structural Changes in Single-Walled Carbon Nanotubes Induced by Pulsed Laser Irradiation (P114) Jeonghong Ha, Dongsik Kim, POSTECH Measurement of Several Tens Pico-Second Laser Pulses Using a SingleShot Frequency Resolved Optical Grating Method (P115) Hoon Jeong, Korea Institute of Industrial Tech; Dongjoo Lee, Swamp Optics Comparative Study of Hole Profile Drilled by Top-Hat or Gaussian Beam (P116) Matthieu Schneider, Yann Rouchausse, Paul Leducq, Jeremie Girardot, Laurent Berthe, Arts et Métiers ParisTech Development of Iso 21254 Compliant Semi-Automatic Lidt Station in the Frame of Hilase Project (P117) Jan Vanda, Institute of Physics AS CR, v. v. i.



Integrated Rapid 3D Mapping and Laser Additive Repair of Gas Turbine Engine Components (P118) Lijue Xue, Yangsheng Li, Jianyin Chen, Shaodong Wang, Glen Campbell, National Research Council Canada; Matt Donovan, United Technologies Aerospace Systems Compact 100W Average Power Ultrafast Fiber Laser for Industrial Micromachining (P119) Franck Morin, Yoann Zaouter, Clemens Hoenninger, Eric Mottay, Amplitude Systemes The Design of a 1250Watt Ldmos Single Transistor Laser Driver in the 40 to 100 Mhz Frequency Range (P120) Richard Brounley, Brounley Engineering, Inc. Power and Energy Scaling of Ultra-Short Pulse Lasers and Application Examples (P121) EdgeWave GmbH Innovative Laser Solutions Material Response of Semiconductors to Femtosecond Laser Excitation in the Infrared Spectral Range (P122) Mark Ramme, Ilya Mingareev, Andrew Housman, Martin Richardson, Townes Laser Institute, Univ. of Central Florida A Labview Based CO2 Laser Cable Marking System (P123) Yacine Boucetta, Bendiba Guedouar, Laid Henni, Slimane Messaoud, Fodil Siserir, Mohamed Traiche, CDTA- Center of Advanced Technologies; Hasan Okay, Bestcable Surface Material Removal of Carbon Fibre Reinforced Plastics by High Power Pulsed Laser (P124) Juan Carlos Hernandez-Castaneda, Gnian Cher Lim, H.Y. Zheng, Singapore Institute of Manufacturing Technology; Jonathan Hobley, Institute of Materials Research and Engineering; Fabrication of High-Aspect Micro 3D Pattern Using Laser Direct Write Lithography System (P125) Sumio Nakahara, Kyoji Matsushima, Kansai Univ. Laser Welding for Hot-Stamped Tailor Welded Blanks with High Strength Steel/High Energy Absorption Steel (P126) Minjung Kang, Cheolhee Kim, Kitech Laser Weldability of Thin Cu and Al Sheets for Lithium Ion Battery Cells (P127) Cheolhee Kim, Taesoon Park, Kitech Effect of Tig Arc on Plume Induced in Fiber Laser Welding (P128) Fei Li, Rongshi Xiao, Beijing Univ. of Technology Modification of Cell Response by Q-Switched Laser Texturing of Titanium (P129) Katy Voisey, Colin Scotchford, Adam Clare, Univ. of Nottingham Projection Ablation of a Buildup Film for High-Density Ic Substrates using a Nanosecond UV Laser (P130) Hyonkee Sohn, Korea Institute of Machinery and Materials The Parameters Optimizing and Joint Heterogeneity Characterization of Fiber Laser Welding for 2024 Aluminum (P132) Joseph Ahn, John Dear, Imperial College; Enguang He, Li Chen, BAMTRI

[email protected]

Poster Presentation Gallery Observation of Cross-Section Surface After Cutting of Cfrp with UV Laser (P133) Tatsuya Nariyama, Fumihiro Matsuoka, Hitoshi Nakano, Graduate School of Science and Engineering, Kinki Univ.; Kazuki Nakai, Graduate School of Engineering, Osaka Univ.; Masahiro Tsukamoto, Yuji Sato, Shinichiro Masuno, Kenjiro Takahashi, Joining and Welding Research Institute, Osaka Univ. Laser-Assisted Machining of Alumina (P134) Xiangyang Dong, Yung Shin, Purdue Univ. Processing and Properties of Duplex Stainless Steel Coatings Manufactured by Coaxial Hot-Wire Laser Cladding (P135) Henri Pajukoski, Jonne Näkki, Jari Tuominen, Petri Vuoristo, Tampere Univ. of Technology/Department of Materials Science; Sebastian Thieme, Steffen Nowotny, Fraunhofen IWS FeCoNiCuCr HEA Coatings Produced by Laser Cladding (P136) Cunyuan Peng, Mingxing Ma, Qiwen Wu, Wenjin Liu, Weiming Zhang, Tsinghua Univ. Effective Calibration and Implementation of Galvanometer Scanners (P137) William Land, Aerotech Inc. Large Angle Acousto-Optic Deflector for Rapid Laser Beam Steering in High Precision Manufacturing (P138) Tiansi Wang, CREOL, The College of Optics & Photonics, Univ. of Central Florida, Chong Zhang, Islam Salama, Intel - Assembly & Test Technology Development; Aleksandar Aleksov, Intel - Components Research; Aravinda Kar, Mechanical and Aeronautical Eng., and Mat. Sci. and Eng. Department, Univ. of Central Florida Temperature Profile in Thin Wires During Laser Heating (P139) Aravinda Kar, Ilandara Sanjitha, Laser-Advanced Materials Processing Laboratory; Raj Vaidyanathan, Advanced Materials Processing and Analysis Center (Ampac) Fatigue Strength of Laser Clad Components (P140) Jari Tuominen, Jonne Näkki, Jarmo Poutala, Juha Miettinen, Petri Vuoristo, Tampere Univ. of Technology; Tuomo Peltola, Technology Centre Ketek Ltd

Laser Patterning of Thin Film Strain Gauges (P141) Oliver Suttmann, Laser Zentrum Hannover e.V. Temperature Cycles During Selective Laser Melting of Hastelloy X Powder in Laser Powder Bed Additive Manufacturing Process (P143) Stephanie Giet, Dacian Tomus, Xinhua Wu, Monash Centre for Additive Manufacturing Remote Laser Cutting of Lead Acid Battery Plates (P144) Daniele Colombo, Barbara Previtali, Giovanni Riva, Bruno Valsecchi, Politecnico Di Milano; Giuseppe Riva, Mr Innovation; Giovanni Masotti, Elen Layer Surface Alloying of Ag-Ha Nanocomposites on Ti6Al4V for Biomedical Applications (P145) Xiangmei Liu, Department of Industrial and Systems Engineering; Hau-Chung Man, Hong Kong Polytechnic Univ. Optimization of High Powered Diode Laser Systems in Direct Cutting of Metals Using Systematic Design of Experiment (P146) Hud Wahab, Laserzentrum FH Münster, Germany High Speed Laser Machining of Difficult-To-Machine Materials (P147) Wenwu Zhang, Ningbo Institute of Materials Technology and Engineering (NIMTE), CAS; Meng Li, Tianrun Zhang, Xiping Zhang, Ningbo Institute of Materials Technology and Engineering High-Pulse-Energy Mode-Locked Picosecond Oscillator (P148) Yang Chao, Meng Chen, Gang Li, Beijing Univ. of Technology Laser Gas Metal Arc Hybrid Welding for Boiler Water Tube Walls (P149) William Mohr, EWI; Ed Hansen, Esab; Peter Nance, CTI Power Division Research on Controlling the Pressing Force and Position of Focus Spot of Laser-Weld Thin-Wall Components (P150) Wu Qiang, Wuxiong Yang, Xubao Wang, Rongshi Xiao, Tiechuan Zuo, Institute of Laser Engineering, Beijing Univ. of Technology, Femtosecond Laser Ablation of Bovine Cortical Bone (P151) Liliana Cangueiro, Rui Vilar, Instituto Superior Técnico

Business Forum & Panel Discussion Chair: Klaus Loeffler, TRUMPF Laser and Systems GmbH, Ditzingen, Germany Tuesday, October 8th • 1:30pm

How to Turn Your Laser Idea into a Sustainable Business This year’s business session will focus on expert advice for the next generation laser business owners. The keynote from David Belforte will give everybody an idea of today’s marketplace situation and the growth scenario. Five successful business owners that started living their totally different Laser Dreams will report on their lessons learned. We will close with a round table discussion that will allow everybody to ask questions and discuss related topics with the experts.

LIA’s Laser Running Club

Run with the President

Are you ready for a quick workout while chatting with the president? Join LIA's Laser Running Club and meet LIA's fast-paced president Klaus Loeffler, along with your colleagues, for the traditional run before the sun. Enjoy a brisk run as the Miami sun rises and chat with the industries best. Participants will meet in the lobby of the hotel and enjoy a great workout. Be one of the first in the lobby and receive a FREE gift! Complete details will be available on-site at ICALEO.


[email protected]


September 11–12, 2013

REGISTER NOW! Schaumburg Convention Center Schaumburg, IL USA

From Stents to Ships Decks, From Automobiles to Airplanes, Lasers Deliver Superior Quality, Performance and Profits!


Robots Software Equipment Integrators

Presented by:

Automation Manufacturers Beam Delivery





[email protected]


Laser Solutions Short Courses Short Courses Chair: Kerstin Kowalick, Ruhr Univ. Bochum, Bochum, Germany This year’s short courses session provides an insight into the diversity of laser processes from nano to macro scale and its related design aspects. The session will start with a comprehensive view on how to implement a successful welding process from component design to process parameters. This will be followed by scanner technology used for remote welding including economical aspects. Control of spatial distribution of a wavefield is on the increase. New technological opportunities supported by examples will be explained in more detail. Besides well suited process and beam parameters micro processing applications do need precision laser micro processing platforms for high accuracy. What are the choices regarding technology selection and how do they impact? A comparatively recent research area with still high potentials deals with the use of ultrashort pulses and material treatment in the nano scale. What are the basic physical processes behind this unique processing regime and how do they create new opportunities e.g. in the field of medicine and biology? The short courses are designed to provide both newcomers and laser experts with new fundamentals and in-depth information along with practical examples. The talks are given by industrial photonics experts as well as advanced scientists.

Course 1: Essential Considerations for Laser Welding - from Component Design to Implementation David Havrilla, TRUMPF Inc., Plymouth, MI, USA As the use of lasers become more widespread, designers and product engineers alike need to gain familiarity with not only the properties, advantages and applicability of the laser welding process, but also with how to design components for successful laser welding. The choice of laser type, component material selection, weld joint design, component part preparation, and part fixturing are all critical to successful implementation of the laser welding process. These topics are presented along with practical examples and case studies, with the intent of building the foundation for sound laser welding design and process implementation. This session, because of its integration of fundamental and practical issues, is suited for both product and manufacturing engineers. The fundamental aspects and case studies are pertinent to those considering laser welding for the first time and for those in the midst of product design or equipment specification. The practical issues are also valuable for this group, but are uniquely relevant for those currently using a laser welding system. The objectives for this course are: 1) Review the unique characteristics and advantages of laser light which enable it to be used as an industrial welding tool 2) Examine the factors upon which focusability is dependent and their influence upon weld energy and the welding process 3) Understand fundamental welding considerations, such as material selection, weld joint geometry & design 4) Analyze several essential keys to success for implementation of the laser joining process Course level: Beginner to Intermediate

Course 2: Remote Laser Welding in Automotive Applications - Views on Technologies and Economics Christoph Franz, Scansonic IPT GmbH, Berlin, Germany Participants will get an overview of existing principles and technical properties of state of the art remote welding heads. The course aims to provide the technical background on this productive technology and gives insights into advanced systems, new applications and their impact on productivity. We will discuss systems with and without F-Theta lens, heads with optical seam detection, integrated process control and systems with integrated clamping. Attendees will also see new applications for side panel welding as well as welding of doors and processing of advanced materials (UHSS and Aluminum). The objectives for this course are: 1) Getting an overview the different types of remote laser heads and their components 2) Recognize the technical properties of state of the art remote scanners 3) Discover how to gain productivity through advanced systems - holistic views on economics 4) Application examples Course level: Intermediate to Advanced

Course 3: L aser Beam Shaping – From Source to Application

The objectives for this course are: 1) Fundamentals of beam shaping 2) S pecific benefits and drawbacks of the different techniques with respect to the input beam parameters, the desired output field and the application 3) S tandard solutions modifications mainly aiming at spatial or temporal averaging for homogenization Course level: Beginner to Intermediate

Course 4: Impact of Motion Technology on High Precision Micro Processing Applications Ron Rekowski, Aerotech Inc., Pittsburgh, PA, USA Users have many choices regarding technology selection and machine configuration when assembling precision laser micro processing platforms. This presentation will discuss the capabilities of various technologies such as linear motor/ballscrew actuation, galvanometer, piezo-electric devices, measurement techniques (static calibration and in-process correction) and their impact on achievable accuracy on the part. The objectives for this course are: 1) B asic understanding of the different bearing/motor technologies and their capabilities as they relate to part finish and accuracy 2) R eview of system calibration methods and the differences between fixed sensitive and moving sensitive measurements 3) R eview of feedback technology used in servo stages and galvanometers and the impact of temperature variation on attainable accuracy 4) Discussion of multi-workpoint systems and off-axis camera measurement techniques 5) Attainable system accuracy for multi-axis systems Course level: Beginner to Intermediate

Course 5: Fundamentals and Applications of the Ultrafast Laser Materials Processing Ilya Mingareev, T ownes Laser Institute, CREOL, Univ. of Central Florida, Orlando, FL, USA Materials processing with femtosecond and picosecond laser pulses has already found many applications in science, medicine and industry, but still has extensive potential for new developments. In order to fully utilize the advantages of this unique processing regime, a basic understanding of the underlying physical principles is necessary. This course provides an introduction to the fundamental physical phenomena occurring when ultrashort laser pulses interact with different materials such as metals, dielectrics and semiconductors. Correlations between the process parameters and the materials’ response will be discussed and illustrated with application examples. The objectives for this course are: 1) Identification of critical process parameters and conditions 2) Comparison between thermal and non-thermal processing regimes 3) Survey of in situ process diagnostics and material characterizations 4) Discussion of process scalability for industrial applications Course level: Intermediate

Roman Kleindienst, Ilmenau Univ. of Technology, Ilmenau, Germany

Course 6: Lasers in Medicine and Biology

Control over the spatial distribution of a wavefield, i.e. beam shaping, is increasingly important in a large variety of laser based applications ranging from illumination to material processing. After introducing the fundamentals of beam shaping, in this short course we discuss the specific benefits and drawbacks of the different beam shaping techniques with respect to the input beam parameters, the desired output field and the application. Besides standard solutions modifications of these approaches mainly aiming at spatial or temporal averaging for homogenization purposes are presented. All theoretical considerations are supported by practical examples and experimental results. In an overview typical technologies for realizing beam shaping components are summarized.

Alexander Heisterkamp, Friedrich-Schiller-Universitaet Jena, Germany


The participants will be introduced to the basic mechanisms of laser-tissue interaction at the different time scales and laser intensities. The introduction of the different technologies will be accompanied by their application within various fields of medicine and diagnostics. Furthermore, aspects of optical imaging like OCT and laser microscopy will be covered. Finally, further examples of the use of laser radiation at the cellular level will be described within the field of Biophotonics. The objectives for this course are: 1) Laser-tissue interaction at different time scales 2) T issue Optics 4) L aser-based therapeutics 3) L aser-based imaging 5) B iophotonics Course level: Beginner to Intermediate

[email protected]


The Global Laser Education PORTAL Providing Practical Online Training for All Laser Users!

Presented by:


Laser Industry Vendor Reception & Tabletop Display

Thank you to the ICALEO Media Partners & Cooperating Societies

Tuesday, October 8th • 4:00pm Sharing Ideas. Discovering Solutions. As the world’s premier conference on laser materials interaction, ICALEO® attracts over 200 companies and organizations from more than 30 countries. The Laser Industry Vendor Program gives vendors and conference attendees the opportunity to discuss equipment and applications in a relaxed setting. After completion of the technical sessions, enjoy drinks and hors d'oeuvres while sharing product ideas with your colleagues and suppliers! This is the only scheduled event for the evening, allowing participants access to the full attention of attendees. For information about participating as an ICALEO Sponsor or Vendor, please contact Jim Naugle at [email protected] Sponsors and Vendors registered as of July 7th: AdlOptica GmbH Advalue Photonics Aerotech Altos Photonics Amplitude Systemes Cambridge Technology Coherent, Inc. Direct Light Electro-Optics Technology Fraunhofer ILT Fraunhofer IWS Hass Laser Technologies HighYag Innovative Laser Technologies, Inc. IPG Photonics Laser Mechanisms Laservision-USA Lee Laser Lincoln Laser Company National Science Foundation Newport Corporation Northrop Grumman Cutting Edge Optronics Nufern Onefive GmbH OZ Optics Photonics Industries International Picoquant Photonics PolarOnyx, Inc. Precitec Preco, Inc. RPMC Lasers Scanlab America SPI Lasers Time Bandwidth, Inc. TRUMPF, Inc. V-Gen Vytran

*Sponsors highlighted in bold*


About LIA Laser Institute of America (LIA), founded in 1968, is the international society dedicated to fostering lasers, laser applications and laser safety worldwide. LIA has grown to represent hundreds of corporate and thousands of individual members in the laser industry. Visit for more information!

Join the LIA! To take advantage of special member registration rates, please go to the LIA website at for membership information and an application, or call +1.800.34LASER or +1.407.380.1553.

[email protected]


> 40 W UV (225 µJ) The highest power UV industrial laser just got more powerful

Breakthrough to a New Level of Speed and Quality Industrial laser technology has taken a giant leap forward – introducing Adjustable pulse width (10 ns example)

Quasar®, a breakthrough hybrid fiber laser delivering >45 W (225 µJ) UV and high repetition rates. Quasar empowers an entirely new level of performance and throughput in micromachining and microelectronics manufacturing. But, that’s only part of its power. The unique design features TimeShiftTM technology for programmable pulse profiles and allows even higher levels of speed, control and flexibility. In some materials, TimeShift actually enables the application.

Pulse shaping (1:2 amplitude ratio example)

Built for 24/7 long-term reliability and the most demanding applications, our newest breakthrough can take your productivity to powerful new levels. Visit or call us at 1-800-775-5273.

Burst mode (10 x 5 ns example) Patent pending ©2013 Newport Corporation



[email protected]

General Information Registration can be completed online or by downloading a PDF registration form from Full conference registration includes admission to all technical sessions, the Plenary Sessions, Laser Solutions Short Courses, Receptions (Welcome Celebration, President’s Reception and Vendor Reception), Awards Luncheon and a technical digest. Student registration includes admission to all technical sessions, the Plenary Sessions, Laser Solutions Short Courses, Receptions (Welcome Celebration, President’s Reception and Vendor Reception), Awards Luncheon and a technical digest. Valid student ID is required to process registration. Student registration will not be accepted on-site; students must be pre-registered by September 10. One-day registration includes admission to technical sessions, Laser Solutions Short Courses and receptions on that day only and a technical digest. Guests may attend the Awards Luncheon and all receptions by purchasing tickets. Please pre-register your guest so we may prepare a nametag. Non-industry guests only. Early Bird registrants must be paid in full by August 13. Visa, MasterCard, Discover and American Express will be accepted. You may send a check (US funds only, drawn on a US bank) payable to Laser Institute of America. Purchase orders must be paid in full by August 13 to qualify for discount. Bank transfers must include a $20 wire transfer fee.

$745..........Member $745..........Cooperating Society $860..........Non-Member $410..........Student $445..........Retired LIA Member (August 14 – September 10) $795..........Member $795..........Cooperating Society $910..........Non-Member $480..........Student $495..........Retired LIA Member (September 11 – On-site) $845..........Member $960..........Non-Member On-site registration not available for Cooperating Society, Student or Retired LIA Member

One Day Conference - Early Bird Registration (Payment received by August 13) $320..........Member $350..........Non-Member (August 14 – September 10) $350..........Member $380..........Non-Member

8:00am – 4:00pm 7:00am – 5:00pm 7:30am – 4:00pm 7:30am – 5:00pm 7:30am – 12:00pm

(September 11 – On-site) $385..........Member $415..........Non-Member

Laser Solutions Short Course - Early Bird Registration (Payment received by August 13)

Hotel Accommodations Hyatt Regency® Miami 400 South East Second Avenue Miami, Florida, USA 33131 Phone: +1.305.358.1234 • Fax: +1.305.358.0529

$320..........Member $350..........Non-Member (August 3 – August 31)

The striking white towers of Hyatt Regency Miami overlook Biscayne Bay and connect to the Convention Center providing effortless access to everything from Brickell and Coral Gables to Coconut Grove and world-famous white sand beaches. Our newly updated Hyatt hotel in downtown Miami offers an outstanding array of amenities - including the city's largest meeting space, dramatic bayside or skyline views from spacious guestrooms, and a lively bar and restaurant. Discover this exclusive setting among downtown Miami Florida hotels and experience the excellence you've come to expect from Hyatt. Book your hotel online at or call +1.305.358.1234. Hotel Reservation Deadline is Friday, September 6th ®

Proceedings CD-Rom Proceedings will be available on-site (they will not be shipped to you). It includes all submitted papers from ICALEO (Plenary, Laser Materials Processing, Laser Microprocessing, Nanomanufacturing and Poster Manuscripts). Payment received by August 13 $145.......Member $170.......Non-Member Payment received after August 13 $155.......Member $180.......Non-Member

Register Online at

Full Conference - Early Bird Registration (Payment received by August 13)

Conference Registration

On-site Registration Times Sunday, October 6 Monday, October 7 Tuesday, October 8 Wednesday, October 9 Thursday, October10


$350..........Member $380..........Non-Member (September 1 – On-site) $385..........Member $415..........Non-Member *Single short course admission fee $100 LIA Member and Non Member. Purchase orders will not be accepted on-site.

Special Needs If you have any special needs that we can address to make your participation more enjoyable, please contact LIA by phone: +1.407.380.1553, 1.800.34.LASER, Fax: +1.407.380.5588 or email: [email protected] Shuttle Service Go to Super Shuttles online, http://www. for a discounted rate of $14.00 per person each way, by using the discount code MN8YM.

*Please note: 7% Sales Tax and Local Tax will be added to the CD-Rom proceedings in accordance with local tax laws.

Rental Cars Call Avis Rental Car at +1.800.331.1600 and mention AVIS worldwide discount number J093783. Average October Temperatures: 86° F / 30°C High 74°F / 23°C Low

Join the LIA! To take advantage of special member registration rates, please go to the LIA website at for membership information and an application, or call +1.800.34LASER or +1.407.380.1553.

Substitutions and Cancellations We understand that circumstances may occur to prevent you from attending the conference. If you find that you are unable to attend ICALEO®, you have several options: 1. Send a substitute. Substitutions can be made at any time – even on-site at the conference. (Please have the substitute bring your letter of confirmation to the registration desk) 2. Refund of monies. Requests for refunds must be made in writing and received on or before August 13. There is a $75 processing fee applied to all refunds. All refunds will be processed after the conference. No refund requests will be accepted after August 13. Guest Tickets, Proceedings & LIA Membership Dues are all non-refundable.


[email protected]


ICALEO ® 2013 Conference Agenda*

Sunday, October 6

Wednesday, October 9

8:00am 9:00am 11:30am 12:00pm 4:00pm

7:30am ICALEO Registration Desk & LIA Bookstore Open 7:45am Attendee Breakfast/Poster Presentation Gallery Q&A 8:30am LMP 11: Welding I LMP 12: Laser Assisted Machining II LMF 5: Additive Micro Processes LMF 6: Microjoining Nano 3: Fabrication of Nanodevices 10:10am Morning Break 10:30am LMP 13: Welding II LMP 14: Laser Assisted Machining III LMF 7: Novel and Emerging Applications Nano 4: Laser Processing of Nanomaterials LIA Annual Meeting & Awards Luncheon 3:00pm LMP 15: Welding of Non-Ferrous Materials I LMP 16: Surface Modification LMP 17: Cladding I LMF 8: Micromachining II 5:00pm Afternoon Break

ICALEO Registration Desk Open Laser Solutions Short Courses LIA Board of Directors Meeting LIA Bookstore Open Welcome Celebration

Monday, October 7 7:00am ICALEO Registration Desk & LIA Bookstore Open 7:30am Session Chair Appreciation Breakfast 8:00am Attendee Continental Breakfast 9:00am Plenary Session: Green Photonics and Recent Progress in Laser-Based Light Sources and Their Applications in Materials Processing 10:10am Morning Break Lunch on own 1:30pm LMP 1: A New Look at Welding LMF 1 (Joint with Nano Conference) 2:50pm Afternoon Break 3:20pm LMP 2: N  ew Laser Sources LMP 3: LAM in Biomedical LMF 2: O  ptics and Beam Delivery Nano 1: Materials Growth and Synthesis 5:30pm President’s Reception

Tuesday, October 8 7:30am ICALEO Registration Desk & LIA Bookstore Open 8:00am Attendee Continental Breakfast 8:00am Poster Presentation Gallery 8:30am LMP 4: Modeling and Simulation LMP 5: Cutting LMP 6: Plastic Welding LMF 3: Laser Surfacing Engineering Nano 2: Nanopatterning and Nanostructuring 10:10am Morning Break 10:40am LMP 7: Drilling LMP 8: Beam and Material Characterization LMF 10: Micromachining I Lunch on own 1:30pm LMP 9: Hybrid Welding LMP 10: Laser Assisted Machining I LMF 4: Industrial Processes and Devices Business Forum & Panel Discussion: Increasing the Role of Lasers in a Non-Laser World 4:00pm Laser Industry Vendor Reception & Tabletop Display

Thursday, October 10 7:30am ICALEO Registration Desk & LIA Bookstore Open 8:00am Attendee Continental Breakfast 8:30am LMP 18: Welding of Non-Ferrous Materials II LMP 19: Processing of CFRP LMP 20: Cladding II LMF 9: Laser Micro Processing Analysis and Modeling 10:10am Morning Break 10:40am LMP 21: Welding of High Strength Steels Nano 5: Advanced 3D Nanomanufacturing Lunch on own 1:30pm Closing Plenary Session 3:50pm Farewell Break

* Program subject to minor changes



[email protected]



Orlando, FL Permit 2342

13501 Ingenuity Drive, Suite 128 Orlando, FL 32826

LIA and ICALEO would like to thank our current sponsors: GOLD Level Sponsors:

SILVER Level Sponsors:

BRONZE Level Sponsor:

13501 Ingenuity Dr. Ste 128, Orlando, FL 32826


Toll Free: 1.800.34.LASER